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J.P. Libous

Observed names: J. Libous, J. P. Libous, J.R. Libous
Institution: IBM (United States)
Observed institution: IBM (United States)
OpenAlex ID: A5066081207
Power distribution networks for system-on-package: status and challenges
2004 · M. Swaminathan, Joungho Kim, et al. · IEEE Transactions on Advanced Packaging · 268
Macromodeling of Nonlinear Digital I/O Drivers
2006 · B. Mutnury, M. Swaminathan, et al. · IEEE Transactions on Advanced Packaging · 81
Measurement, modeling, and simulation of flip-chip CMOS ASIC simultaneous switching noise on a multilayer ceramic BGA
1997 · J.P. Libous, D.P. O'Connor · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 47
Modeling and simulation of core switching noise for ASICs
2002 · Nanju Na, Jinwoo Choi, et al. · IEEE Transactions on Advanced Packaging · 32
Macro-modeling of non-linear I/O drivers using spline functions and finite time difference approximation
2003 · B. Mutnury, M. Swaminathan, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 27
A one-million-circuit CMOS ASIC logic family
2002 · R. Gregor, C. Ng, et al. · Custom Integrated Circuits Conference · 17
Effect of substrate resistivity on switching noise in on-chip power distribution networks
2003 · Jifeng Mao, M. Swaminathan, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 13
Characterization of flip-chip CMOS ASIC simultaneous switching noise on multilayer organic and ceramic BGA/CGA packages
2002 · J.P. Libous · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 8
I/O cell placement and electrical checking methodology for ASICs with peripheral I/Os
2002 · G. Yasar, C. Chiu, et al. · International Symposium on Quality Electronic Design (ISQED) · 8
Modeling of power supply noise using efficient macro-model of non-linear driver
2004 · B. Mutnury, M. Swaminathan, et al. · 7
Comparison of multilayer organic and ceramic package simultaneous switching noise measurements using a 0.16 μm CMOS test chip
2002 · T. Budell, J. Audet, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Effect of organic package core via pitch reduction on power distribution performance
2004 · J. Audet, D.P. O'Connor, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Electromagnetic modelling of switching noise in on-chip power distribution networks
2003 · Jifeng Mao, Woopoung Kim, et al. · International Conference on Electromagnetic Interference and Compatibility · 6
Modeling and simulation of core switching noise on a package and board
2002 · N. Na, M. Swaminathan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
The Use of Accelerated Full-Wave Modeling to Analyze Power Island Coupling in a HyperBGA SCM
2007 · Jason Morsey, Alina Deutsch, et al. · IEEE Transactions on Advanced Packaging · 4
Measurement, modeling, and simulation of flip-chip CMOS ASIC simultaneous switching noise on a multi-layer ceramic BGA
2002 · J.P. Libous, D.P. O'Connor · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 2
The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM
2006 · J. Morsey, A. Deutsch, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Comparison of Multilayer Organic and Ceramic Package Simultaneous Switching Noise Measurements using a 0.16 µ
2001 · T. Budell, Jean Audet, et al.
Works count: 18
Citation count: 538
H-index: 8
I10-index: 7
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