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Welch Lin

Observed names: W. M. Lin, W.M. Lin
OpenAlex ID: A5066094403
CMP process development for the via-middle 3D TSV applications at 28nm technology node
2011 · T.C. Tsai, W.C. Tsao, et al. · Microelectronic Engineering · 54
Process development of high-k metal gate aluminum CMP at 28nm technology node
2011 · Y.H. Hsien, H.K. Hsu, et al. · Microelectronic Engineering · 35
Defect reduction of replacement metal gate aluminum chemical mechanical planarization at 28nm technology node
2013 · H.K. Hsu, T.C. Tsai, et al. · Microelectronic Engineering · 15
Investigation of aluminum film properties and microstructure for replacement metal gate application
2013 · R.P. Huang, T.C. Tsai, et al. · Microelectronic Engineering · 10
Low leakage reliability characterization methodology for advanced CMOS with gate oxide in the 1nm range
2005 · S.S. Chung, H.J. Feng, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 3
The TDDB Study of Post-CMP Cleaning Effect for L40 Direct Polished Porous Low K Dielectrics Cu Interconnect
2010 · Chia-Lin Hsu, Welch Lin, et al. · ECS Transactions · 2
Micro-scratch reduction of replacement metal gate aluminum chemical mechanical polishing at 28nm technology node
2012 · C. W. Hsu, R. P. Huang, et al. · IEEE International Interconnect Technology Conference (IITC) · 1
Evaluation of aluminum film properties and microstructure for replacement metal gate application at 28nm technology node
2011 · R. P. Huang, Y. H. Hsien, et al. · IEEE International Interconnect Technology Conference (IITC) · 1
Advanced Rework Process Development for Cu-CMP at 28 nm Technology Node
2010 · Jen-Chieh Lin, Teng-Chun Tsai, et al. · ECS Transactions · 1
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In-line high-K/metal gate monitoring using picosecond ultrasonics
2013 · C. W. Hsu, R. P. Huang, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
CMP Defect Monitoring in HKMG Loop on Monitor Wafers
2012 · Peng Ren, Chun Wei Hsu, et al.
Development of a Production Worthy Non-Selective Slurry W-CMP for Logic Applications at 28nm Technology Node and Beyond
2010 · Hsin-Kuo Hsu, Y. H. Hsieh, et al. · ECS Transactions
The TDDB Study Of Post-CMP Cleaning Effect for L40 Direct Polished Porous Low K Dielectrics Cu Interconnect
2010 · Chia-Lin Hsu, Welch Lin, et al. · ECS Meeting Abstracts
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Development of a Production Worthy Non-Selective Slurry W-CMP for Logic Applications at 28nm Technology Node and Beyond
2010 · Single Hsu, Duckblood Hsieh, et al. · ECS Meeting Abstracts
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Advanced Rework Process Development for Cu-CMP at 28 nm Technology Node
2010 · Jen-Chieh Lin, Chih-Hsien Chen, et al. · ECS Meeting Abstracts
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Reliability of ALD Hf-based High K Gate Stacks with Optimized Interfacial Layer and Pocket Implant Engineering
2007 · A. Y. Mao, W. M. Lin, et al. · International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)
Channel soft breakdown enhanced excess low-frequency noise in ultra-thin gate oxide PD analog SOI devices
2005 · S. Chiang, M.C. Chen, et al. · IEEE International Reliability Physics Symposium proceedings
Works count: 17
Citation count: 122
H-index: 4
I10-index: 4
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