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C.-L. Liu

OpenAlex ID: A5066249706
General model for mechanical stress evolution during electromigration
1999 · M. E. Sarychev, Yu. V. Zhitnikov, et al. · Journal of Applied Physics · 164
Defect generation and diffusion mechanisms in Al and Al–Cu
1999 · C.-L. Liu, X.-Y. Liu, et al. · Applied Physics Letters · 45
Reduced oxygen diffusion through beryllium doped platinum electrodes
1999 · R. Stumpf, C.-L. Liu, et al. · Applied Physics Letters · 19
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A new, general model for mechanical stress evolution during electromigration
2000 · M.E. Sarychev, Yu.V. Zhitnikov, et al. · Thin Solid Films · 17
The Recovery Behavior of Quenched-in Vacancies in CuZnAl Alloy
1989 · T.-M. Wang, B.-Y. Wang, et al. · physica status solidi (a) · 16
Computer aided design of sub-100 nm strained-Si/Si/sub 1-x/Ge/sub x/ NMOSFET through integrated process and device simulations
2003 · A.V.-Y. Thean, A.L. Barr, et al. · International Conference on Simulation of Semiconductor Processes and Devices · 1
Stress Effects on Al and Al(Cu) Thin Film Grain-Boundary Diffusion
1999 · X.-Y. Liu, C.-L. Liu · MRS Proceedings
Works count: 7
Citation count: 262
H-index: 5
I10-index: 5
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