Get started
Author

Franz Xaver Röhrl

Observed names: F. X. Röhrl, Franz Roehrl, Franz Rohrl, Franz Röhrl, Franz X. Rohrl, Franz X. Röhrl, Franz Xaver Roehrl, Franz Xaver Rohrl, Rohrl Franz Xaver
ORCID: 0000-0003-1898-8179
Observed ORCID: 0000-0003-1898-8179
OpenAlex ID: A5066337614
Multilayer Topology Optimization of Wideband SIW-to-Waveguide Transitions
2020 · Emadeldeen Hassan, Benedict Scheiner, et al. · IEEE Transactions on Microwave Theory and Techniques · 49
Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air
2020 · Felix Sepaintner, Andreas Scharl, et al. · IEEE Transactions on Microwave Theory and Techniques · 12
Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air
2019 · Felix Sepaintner, Andreas Scharl, et al. · IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) · 10
Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications
2018 · Franz Xaver Rohrl, Johannes Jakob, et al. · European Microwave Conference (EuMC) · 10
Differential wideband interconnects for organic millimeter wave chip packages: An effort to design an all-purpose RF chip package
2016 · Franz Xaver Rohrl, Johannes Jakob, et al. · European Microwave Integrated Circuits Conference · 9
An Effective Surface Impedance Concept to Model Arbitrary Roughness Profiles on Printed Circuit Boards up to 110 GHz
2023 · Felix Sepaintner, Andreas Scharl, et al. · IEEE Microwave and Wireless Technology Letters · 8
Cost-effective SIW band-pass filters for millimeter wave applications a method to combine low tolerances and low prices on standard pcb substrates
2017 · Franz Xaver Rohrl, Roman Sammer, et al. · European Microwave Conference (EuMC) · 8
WR12 to planar transmission line transition on organic substrate
2019 · Johannes Jakob, Roman Sammer, et al. · European Microwave Conference (EuMC) · 7
Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz
2021 · Felix Sepaintner, Michael Schmalzbauer, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 5
Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions
2015 · Franz Xaver Rohrl, Johannes Jakob, et al. · European Microwave Conference (EuMC) · 5
Extension of Falconer's Monostatic to Bistatic Equivalence Theorem with Respect to Reconfigurable Intelligent Surface Testing
2025 · F. T. Bette, O. Kasap, et al. · Digest - IEEE Antennas and Propagation Society. International Symposium · 4
Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards
2020 · Felix Sepaintner, Andreas Scharl, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 4
Comparison of an Inkjet Fabrication Method on Low-Cost PCB Substrates With Semi Additive And Subtractive Technologies Regarding RF-Performance
2021 · Felix Sepaintner, Michael Schmalzbauer, et al. · IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) · 3
Bare die connections via aerosol jet technology for millimeter wave applications
2019 · Franz Xaver Röhrl, Johannes Jakob, et al. · International Journal of Microwave and Wireless Technologies · 3
PDF
Differential wideband interconnects for organic millimeter wave chip packages: An effort to design an all-purpose RF chip package
2016 · Franz Xaver Rohrl, Johannes Jakob, et al. · European Microwave Conference (EuMC) · 3
Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz
2020 · Felix Sepaintner, Andreas Scharl, et al. · IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) · 2
A Finite Element Method to Model Transmission Lines with Various Rough Conductor Surfaces up to 110 GHz
2025 · Felix Sepaintner, Franz Roehrl, et al. · IEEE MTT-S International Microwave Symposium digest · 1
Extension of Falconer's Monostatic to Bistatic Equivalence Theorem with Respect to Reconfigurable Intelligent Surface Testing
2025 · Fabian T. Bette, Onur Kasap, et al. · 1
PDF
A Modified Gradient Model to Determine Surface Impedance from Measured Roughness Profiles with Printed Circuit Board Emphasis
2024 · Felix Sepaintner, Andreas Scharl, et al. · IEEE MTT-S International Microwave Symposium digest · 1
Reliability Investigations of Additive Manufactured RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology
2022 · Michael Schmalzbauer, Johannes Jakob, et al. · European Microwave Conference (EuMC) · 1
Design and Comparison of Filter Structures in the Millimeter Wave Frequency Range on Outer- and Inner-Layers of Organic Circuit Boards
2021 · Andreas Scharl, Felix Sepaintner, et al. · European Microwave Conference (EuMC) · 1
Experimental Validation of Surface Roughness Effects on Effective Conductivity and Related Applications
2026 · Felix Sepaintner, Franz Xaver Roehrl, et al.
Extension of Falconer's Monostatic to Bistatic Equivalence Theorem with Respect to Reconfigurable Intelligent Surface Testing
2025 · Fabian T. Bette, Onur Kasap, et al.
A Robust And Cost-Effective Process Control Monitor Concept to Verify Quality Characteristics of Printed Circuit Boards up to 40 GHz
2024 · Felix Sepaintner, Andreas Scharl, et al. · German Microwave Conference
A Cost-Effective Method for Extracting the Complex Permittivity of Inner Layer Dielectric PCB Materials
2022 · Andreas Scharl, Felix Sepaintner, et al. · European Microwave Conference (EuMC)
Works count: 27
Citation count: 147
H-index: 7
I10-index: 4
Year
Topic
Type