Get started
Author

Cheol‐Hee Moon

Observed names: C.-B. Moon, Cheol-Hee Moon, CheolHee Moon, Moon, Cheol-Hee
Institution: Hoseo University
ORCID: 0000-0002-3379-4017
Observed ORCID: 0000-0002-3379-4017
OpenAlex ID: A5068047809
Change of effective thermal resistance of LED package according to an input current level
2013 · Peng Fei Ji, Cheol-Hee Moon · Solid-State Electronics · 17
Improvement of Light Extraction Efficiency of LED Packages Using an Enhanced Encapsulant Design
2014 · Hyun-Su Choi, Joon-Sik Park, et al. · Journal of the Optical Society of Korea · 6
PDF
Enhancement of upward thermal dissipation in a 16-Chip LED package using ceramic barrier ribs
2013 · Young-Tae Bang, Cheol-Hee Moon · Electronic Materials Letters · 6
Effects of some factors on the thermal-dissipation characteristics of high-power LED packages
2012 · Peng Fei Ji, Cheol-Hee Moon · Journal of Information Display · 5
PDF
Improvement of the Light Extraction Efficiency of LED Package Using Double-Layered Encapsulant with Curved Interface
2015 · Hyun-Su Choi, Cheol-Hee Moon · Journal of Nanoelectronics and Optoelectronics · 3
Highly efficient blue organic light-emitting diodes using various hole and electron confinement layers
2015 · Jin Sung Kang, Ju-An Yoon, et al. · Chinese Optics Letters · 3
PDF
Single Isolation Structure for Organic Light-Emitting Diodes
2009 · Seungjun Yi, Youn Soo Shin, et al. · Japanese Journal of Applied Physics · 3
Solution-Processed Organic Light-Emitting Diodes Using a Lamination Method
2024 · Dong-Heon Yoo, Cheol-Hee Moon · Applied Sciences · 2
PDF
All-Solution-Processed OLEDs Using Printed Ag Electrodes and a PEI Bonding Layer
2023 · Cheol-Hee Moon · 대한금속재료학회지 · 2
PDF
Effect of radius of curvature of a convex interface on the light output power of light-emitting diode package with double-layered encapsulant
2015 · Hyun-Su Choi, Cheol-Hee Moon · Journal of Information Display · 2
PDF
Effect of the Epoxy Mold on the Thermal Dissipation Behavior of LED Package
2012 · Young-Tae Bang, Cheol-Hee Moon · Journal of the Korean Institute of Illuminating and Electrical Installation Engineers · 2
Thermal Dissipation Characteristics of Multi-Chip LED Packages
2011 · Byung-Ho Kim, Cheol-Hee Moon · Journal of the Korean Institute of Illuminating and Electrical Installation Engineers · 2
Microplasma Current Switch and Its Characteristics
2010 · Seungjun Yi, Jie Yu Cai, et al. · IEEE Transactions on Plasma Science · 2
Organic Light-Emitting Diodes Laminated with a PEI Adhesion Layer
2023 · Dong-Heon Yoo, Cheol-Hee Moon · Electronics · 1
PDF
Encapsulation of a Flexible OLED Using a Sealing Line
2018 · Moon, Cheol-Hee · 대한금속재료학회지 · 1
PDF
Heat Dissipation Analysis of High-Power, Multi-Chip LED Bulbs
2018 · Moon, Cheol-Hee · 대한금속재료학회지 · 1
PDF
Organic Light Emitting Diode (OLED) Encapsulation with Low Melting Point Alloy (LMPA)-Epoxy Double Line Structure Using Instantaneous Discharge
2015 · Kyung-Min Park, Cheol-Hee Moon · Journal of Nanoelectronics and Optoelectronics · 1
Variation of Junction Temperature According to Chip Configuration for a High-Power LED Package
2013 · Cheol-Hee Moon, Byung-Ho Kim, et al. · 대한금속재료학회지 · 1
Estimation of heat dissipation through the interchip structure for a multichip light-emitting diode package via simulation
2013 · Young-Tae Bang, Cheol-Hee Moon · Journal of Information Display · 1
PDF
The effect of the cell size on the discharge characteristics of a plasma display panel
2011 · Cheol-Hee Moon · Journal of Information Display · 1
PDF
29.2: Low‐Cost Barrier Rib and Address Electrode Formation for a 42‐in. High‐Definition PDP
2003 · Yoshitaka Terao, Takashi Miyama, et al. · SID Symposium Digest of Technical Papers · 1
An Investigation of the Stability and Tailorability of Coated Alumina Reinforced Titanium Metal Matrix Composites
1998 · Roy C Iggulden, Cheol-Hee Moon, et al. · Scripta Materialia · 1
Enhanced Performance of Laminated OLEDs Through Solution Processing Techniques
2024 · Cheol-Hee Moon, DongHeon Yoo · Proceedings of the International Display Workshops
Two-Substrates OLEDs Using an Interfacial Adhesive Layer
2023 · DongHeon Yoo, CheolHee Moon · Proceedings of the International Display Workshops
Flexible OLED Encapsulation with LMPA Line
2019 · Geon Bae, Cheol-Hee Moon · 대한금속재료학회지
PDF
Works count: 35
Citation count: 64
H-index: 4
I10-index: 1
Year
Topic
Type