Get started
Author

Lingxue Guo

Observed name: L.C. Guo
Observed institution: Central South University
ORCID: 0009-0008-7191-7744
Observed ORCID: 0009-0008-7191-7744
OpenAlex ID: A5068414905
High-temperature Ga–P-modified Sn–0.7Cu-based solder: oxidation resistance and solderability
2025 · Chen Liu, Lingxue Guo, et al. · Journal of Materials Science Materials in Electronics · 5
Laser Re-melting of Mg–Zn–Zr Alloys: Microstructure Evolution and Solidification Defects
2025 · Wei Sun, Lingxue Guo, et al. · Metallurgical and Materials Transactions A · 2
Breaking up of liquid SnPb film on the gold-coated copper wetting channel
2015 · W. Liu, S.D. Zhang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
Growth morphology and crystallography of Cu6Sn5 in Sn-xBi-1Ag/Cu solder joints
2026 · Jieli Liao, Xiaojuan Hu, et al. · Applied Surface Science
Solidification behavior and nanoindentation response of Bi-Ni and Bi-In microalloyed low-Ag SAC105 solder alloys
2026 · Xiaojuan Hu, Lingxue Guo, et al. · SSRN Electronic Journal
Study on the formation mechanism of liquid film on the Au/Cu bilayered film
2016 · W. Liu, S.D. Zhang, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Works count: 6
Citation count: 8
H-index: 2
I10-index:
Year
Topic
Type