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Author

Viktor Gonda

Observed names: Gonda, Viktor, V Gonda, V. Gonda, Victor Gonda, Viktor GONDA
Institution: Obuda University
ORCID: 0009-0009-4755-4549
Observed ORCID: 0009-0009-4755-4549
OpenAlex ID: A5068451414
Review of Peridynamics: Theory, Applications, and Future Perspectives
2021 · Gábor Ladányi, Viktor Gonda · Strojniški vestnik – Journal of Mechanical Engineering · 28
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Improved RF Devices for Future Adaptive Wireless Systems Using Two-Sided Contacting and AlN Cooling
2009 · Lis K. Nanver, Hugo Schellevis, et al. · IEEE Journal of Solid-State Circuits · 21
Prediction of thermo-mechanical integrity of wafer backend processes
2004 · V. Gonda, J.M.J. Den Toonder, et al. · Microelectronics Reliability · 21
Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
2005 · V. Gonda, J. den Toonder, et al. · Journal of Electronic Packaging · 20
State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
2004 · K. M. B. Jansen, V. Gonda, et al. · Journal of Electronic Packaging · 15
Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time- and temperature-effects
2004 · J. den Toonder, A. van Dijken, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14
The Relationship between Surface and In-Depth Hardness for the Nitrocarburizing Treatment Process
2021 · Mihály Réger, Richárd Horváth, et al. · Metals · 13
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Near-Ideal Implanted Shallow-Junction Diode Formation by Excimer Laser Annealing
2006 · V. Gonda, A. Burtsev, et al. · International Conference on Advanced Thermal Processing of Semiconductors · 12
Electrical Characterization of Residual Implantation-Induced Defects in the Vicinity of Laser-Annealed Implanted Ultrashallow Junctions
2006 · V. Gonda, S. Liu, et al. · MRS Proceedings · 10
Ultrashallow doping by excimer laser drive-in of RPCVD surface deposited arsenic monolayers
2008 · Milos Popadic, Lis K. Nanver, et al. · International Conference on Advanced Thermal Processing of Semiconductors · 9
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques
2006 · V. Gonda, K.M.B. Jansen, et al. · Microelectronics Reliability · 9
Excimer laser annealing for ultrashallow junctions and contacts
2008 · Viktor Gonda · Data Archiving and Networked Services (DANS) · 8
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Solder joint reliability based on creep strain energy density for SAC305 and doped SAC solders
2021 · Ramiro Sebastian Vargas Cruz, Viktor Gonda · MATEC Web of Conferences · 7
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Integration of laser-annealed junctions in a low-temperature high-k metal-gate MISFET
2009 · Cleber Biasotto, Vladimir Jovanovic, et al. · Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon · 6
Special RF/microwave devices in Silicon-on-Glass Technology
2008 · L. K. Nanver, H. Schellevis, et al. · IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) · 6
Silicon-on-glass technology for RF and microwave device fabrication
2006 · Lis K. Nanver, H. Schellevis, et al. · IEEE International Conference on Solid-State and Integrated Circuit Technology · 6
Reliability Issues Related to Laser-Annealed Implanted Back-Wafer Contacts in Bipolar Silicon-on-Glass Processes
2006 · G. Lorito, V. Gonda, et al. · IEEE International Conference on Microelectronics (MIEL) · 6
Comparison of Microstructure, Density and Shrinkage Porosity for Casting and Rheocasting of AlSi7Mg alloy
2023 · Kawan Abdulrahman, Viktor Gonda, et al. · Research Square · 5
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Creep and Reliability Prediction of a Fan-Out WLP Influenced by the Visco-Plastic Properties of the Solder
2022 · Ramiro Sebastian Vargas Cruz, Viktor Gonda · Acta Polytechnica Hungarica · 5
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SiGe HBTs implemented with implanted laser-annealed emitters to completely eliminate the transient enhanced diffusion
2008 · G. Lorito, V. Gonda, et al. · IEEE International Conference on Microelectronics (MIEL) · 5
Silicon Laser Annealing by a Two-Pulse Laser System with Variable Pulse Offsets
2007 · V. Gonda, J. Slabbekoorn, et al. · International Conference on Advanced Thermal Processing of Semiconductors · 5
Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling
2024 · Ramiro Sebastian Vargas Cruz, Viktor Gonda · Metals · 4
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Finite element simulation of hardness testing with different material models
2022 · F. Oláh, M. Réger, et al. · IOP Conference Series Materials Science and Engineering · 4
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Comparison of the thermal-mechanical behavior of a soldered stack influenced by the choice of the solder
2019 · Ramiro S. Vargas C, Viktor Gonda · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Analysis of Recrystallization Peak Occuring During DSC Measurement
2018 · Gergő Richárd Fejes, Viktor Gonda, et al. · Acta Materialia Transylvanica · 4
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Works count: 80
Citation count: 301
H-index: 9
I10-index: 9
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