2023 · Eniko Szilagyi, Dorin Petreus, et al. · International Aegean Conference on Electrical Machines and Power Electronics & International Conference on Optimization of Electrical and Electronic Equipment (ACEMP-OPTIM) · 3

Optimal energy management for an islanded microgrid with battery degradation cost considerations

2024 · E. Szilagyi, D. Petreus, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 2

A Comparative Study of Short-Term Load Forecasting Methods for Improved Energy Management in Microgrids with Battery Storage

2025 · Toma Patarau, Dorin Petreus, et al. · International Spring Seminar on Electronics Technology · 1

Energy Management System for an Islanded Microgrid using Stochastic Dynamic Programming under Uncertainty

2023 · Eniko Szilagyi, Dorin Petreus, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 1

Day-Ahead Cost Optimization of an Islanded Microgrid: A Practical Approach

2023 · Nicolae Alexandru Sârbu, Dorin Petreuș, et al. · International Aegean Conference on Electrical Machines and Power Electronics & International Conference on Optimization of Electrical and Electronic Equipment (ACEMP-OPTIM) · 1

A New Low Friction Die Design for Equal Channel Angular Extrusion

2008 · Traian Canta, Dan Frunză, et al. · Key engineering materials · 1

Energy Management Algorithm in Smart Microgrids with Renewable Energies That Uses Battery Degradation Cost and Short-Term Consumption Prediction

2026 · TOMA PĂTĂRĂU, DORIN PETREUȘ, et al. · Journal of Engineering Sciences and Innovation

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Mathematical and Simulation Model of a Grid Connected Fuel Cell System

2026 · Dorin Petreus, Toma Patarau, et al. · IEEE International Conference on Automation, Quality and Testing, Robotics (AQTR)

Design of a Flat Coil Electrothermal Vaporization Device for Inductively Coupled Plasma Optical Emission Spectrometry

2024 · S. Cadar, D. Petreuș, et al. · International Spring Seminar on Electronics Technology

Comparative analysis of two types of filaments with COMSOL for electrothermal process

2023 · Sergiu Cadar, Dorin Petreus, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)

Application of Ultrasonic Sensors in Mapping Vineyard Parameters

2020 · E. Szilagyi, S. Meza, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)

A New Low Friction Die Design for Equal Channel Angular Extrusion

2008 · Traian Canta, Dan Frunză, et al. · Key engineering materials

Works count: 19

Citation count: 100

H-index: 6

I10-index: 3