Author

Jack P. Lombardi

Observed names: J. P. Lombardi, J.P. Lombardi, Jack Lombardi, Jack P Lombardi
ORCID: 0000-0001-9244-3092
Observed ORCID: 0000-0001-9244-3092
OpenAlex ID: A5070170482
2016 · Roozbeh (Ross) Salary, Jack P. Lombardi, et al. · Journal of Manufacturing Science and Engineering · 123
2019 · Yang Gao, Varun V. Soman, et al. · IEEE Transactions on Instrumentation and Measurement · 80
2021 · Roozbeh (Ross) Salary, Jack P. Lombardi, et al. · Journal of Micro and Nano-Manufacturing · 54
2017 · Roozbeh (Ross) Salary, Jack P. Lombardi, et al. · Journal of Manufacturing Science and Engineering · 50
2015 · Wei Zhao, Jin Luo, et al. · Small · 41
2016 · Ning Kang, Fang Lin, et al. · ACS Sensors · 37
2019 · Roozbeh Ross Salary, Jack P. Lombardi, et al. · ASME International Manufacturing Science and Engineering Conference (MSEC) · 28
2018 · Jack P. Lombardi, Robert E. Malay, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 27
2023 · Kang Jun Bai, Clare Thiem, et al. · IEEE Circuits and Systems Magazine · 24
2017 · Mark D. Poliks, Yi-Lin Sung, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 23
2019 · Jack P. Lombardi, Roozbeh (Ross) Salary, et al. · Journal of Manufacturing Science and Engineering · 21
2018 · Rajesh Sharma Sivasubramony, Nardeeka Adams, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 18
2016 · Roozbeh (Ross) Salary, Jack P. Lombardi, et al. · ASME International Manufacturing Science and Engineering Conference (MSEC) · 17
2017 · Jack Lombardi, Mark D. Poliks, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15
2018 · Roozbeh (Ross) Salary, Jack P. Lombardi, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 14
2019 · G.S. Khinda, M.Z. Kokash, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13
2020 · Roozbeh (Ross) Salary, Jack P. Lombardi, et al. · Journal of Manufacturing Science and Engineering · 10
2018 · Mohammed Alhendi, Jack P. Lombardi, et al. · IMAPSource Proceedings · 10
2022 · Shan Yan, Dong K. Dinh, et al. · ACS Applied Materials & Interfaces · 8
2018 · Jack P. Lombardi, Roozbeh (Ross) Salary, et al. · ASME International Manufacturing Science and Engineering Conference (MSEC) · 7
2023 · Kang Jun Bai, Daniel Titcombe, et al. · International Symposium on Quality Electronic Design (ISQED) · 5
2019 · Roozbeh (Ross) Salary, Jack P. Lombardi, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 5
2019 · Gurvinder Singh Khinda, Matthew Strohmayer, et al. · ACS Applied Electronic Materials · 5
Works count: 38
Citation count: 701
H-index: 15
I10-index: 20
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