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Hao Zhao

Microstructural Degradation and Creep Property Damage of a Second-Generation Single Crystal Superalloy Caused by High Temperature Overheating
2023 · Xiaotong Guo, Hao He, et al. · Materials · 13
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Analysis of Residual Stress at the Interface of Epoxy-Resin/Silicon-Wafer Composites During Thermal Aging
2024 · Jianyu Wu, Fangzhou Chen, et al. · Polymers · 11
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Erosion behaviors and mechanisms of Ti3AlC2 material under arc discharge in various mixed atmospheres
2024 · Hao Zhao, Xin Zhao, et al. · Ceramics International · 9
Arc erosion resistance of Cu/Ti2SnC electrical contact materials under various component ratios and atmosphere conditions
2025 · Zijue Zhou, Xiaochen Huang, et al. · Ceramics International · 8
A novel method for fabricating dual-continuous pore-ligament porous copper and application in power device packaging
2025 · Jiahao Liu, Lijin Qiu, et al. · Materials Letters · 4
A novel thermal interface materials based on porous metal copper filled tin for die attachment in power device packaging
2024 · Jiahao Liu, Lu Han, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Research for the development of advanced packaging material testing technology and standardization
2023 · Zhaoning Sun, Peijing Liu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Optimizing fatigue damage of through-silicon via based on the real microstructure
2026 · Dongyang Tian, Jiahao Liu, et al. · Journal of Materials Science Materials in Electronics · 1
Effect of Residual Stress After Reflow Soldering of Ball Grid Array Mixed Solder Joint on Thermal Cycling Reliability
2023 · Fangzhou Chen, Jiahao Liu, et al. · International Conference on Reliability, Maintainability and Safety · 1
Microstructure evolution and phase transformation in quaternary Co-9Al-10W-4Mo alloy during heat treatment
2022 · Lihui Zhang, Zhijun Sun, et al. · Engineering for Rural Development · 1
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Application of Porous Copper-Based Interconnect Materials in Electronic Packaging: A Brief Review
2026 · Jiahao Liu, Lijin Qiu, et al. · Materials
Characterization of Mechanical Deformation Resistance of a Novel Interconnection Solder Based on Porous Copper-Filled SAC305 for Deep Space Exploration
2026 · Jiahao Liu, Xuemei Zhong, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Design and Predictive Methodology for Submicron TSV Interconnect Structures Based on Thermo-Mechanical Coupling Damage Mechanism
2026 · Zhuotong Li, Caixia Liang, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Research on the protrusion behavior and evolution mechanism of TSV in 3D packaging under high temperature
2026 · Jiahao Liu, Lijin Qiu, et al. · Soldering and Surface Mount Technology
Arc Erosion Behaviors and Mechanisms of Cu‐Ti 3 AlC 2 Electrical Contact Materials in Different Mixed Atmospheres
2026 · Xin Zhao, Hao Zhao, et al. · Advanced Engineering Materials
Fracture Analysis of QBe2.0 Beryllium Bronze Conductive Spring
2023 · Ziyang Li, Kun Zhang, et al. · International Conference on Reliability, Maintainability and Safety
High temperature creep behaviour of re-containing nickel-based single crystal superalloy
2022 · Chenguang Liu, Zhijun Sun, et al. · Engineering for Rural Development
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Works count: 17
Citation count: 52
H-index: 4
I10-index: 2
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