Author

Anton Alexeev

Observed names: A. Alexeev, Alexeev, A, Anton, Alexeev

Institution: EV Group (Austria)

Observed institutions: EV Group (Austria), Eindhoven University of Technology

ORCID: 0000-0002-5597-0691

Observed ORCID: 0000-0002-5597-0691

OpenAlex ID: A5070442559

Characterization of dynamic distortion in LED light output for optical wireless communications

2021 · Anton Alexeev, Jean-Paul M. G. Linnartz, et al. · Photonics Research · 40

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Wireless Communication over an LED Channel

2020 · Jean-Paul M. G. Linnartz, Xiong Deng, et al. · IEEE Communications Magazine · 37

Multiple Heat Source Thermal Modeling and Transient Analysis of LEDs

2019 · Anton Alexeev, Grigory Onushkin, et al. · Energies · 32

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Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers

2024 · Shuo Kang, Serena Iacovo, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 21

Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs

2018 · A. Alexeev, G. Martin, et al. · Microelectronics Reliability · 17

Structure function analysis and thermal compact model development of a mid-power LED

2017 · Anton Alexeev, Genevieve Martin, et al. · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 17

Dynamic response-based LEDs health and temperature monitoring

2020 · Anton Alexeev, Jean-Paul Linnartz, et al. · Measurement · 16

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Modeling and compensating dynamic nonlinearities in LED photon-emission rates to enhance OWC

2019 · Shokoufeh Mardani, Anton Alexeev, et al. · Light-Emitting Devices, Materials, and Applications · 16

Requirements specification for multi-domain LED compact model development in Delphi4LED

2017 · A. Alexeev, R. Bornoff, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 14

Wafer-to-Wafer Bonding with Saddle-Shaped Wafers

2025 · Shuo Kang, Serena Iacovo, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7

An LED Communication Model Based on Carrier Recombination in the Quantum Well

2021 · Jean-Paul M. G. Linnartz, Xiong Deng, et al. · IEEE International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC) · 7

Simulating light conversion in mid-power LEDs

2016 · A. Alexeev, W. Cassarly, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 5

Characterization of light emitting diodes with transient measurements and simulations

2020 · Alexeev, A · TU/e Research Portal · 4

Influence of dome phosphor particle concentration on mid-power LED thermal resistance

2016 · Anton Alexeev, Genevieve Martin, et al. · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 4

Accurate thermal transient measurements interpretation of monochromatic LEDs

2019 · Anton, Alexeev, Martin, Genevieve, et al. · TU/e Research Portal · 3

Experimental Verification of Thermal Structure Function Distortion for LEDs with Silicone Domes

2018 · Anton Alexeev, Genevieve Martin, et al. · International Workshop on Thermal Investigations of ICs and Systems · 3

Wafer-to-Wafer Bonding for Advanced Manufacturing Nodes

2024 · Thomas Plach, Anton Alexeev, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 1

A Data Driven Roadmap to Sub 25 nm Bonding Overlay in Wafer to Wafer Hybrid Bonding

2026 · Serena Iacovo, koen D'havé, et al. · Research Square