Author

Tae-Young Lee

Institutions: Tech University of Korea, Korea Institute of Industrial Technology

Observed institutions: Tech University of Korea, Korea Institute of Industrial Technology

ORCID: 0009-0001-8816-1479

Observed ORCID: 0009-0001-8816-1479

OpenAlex ID: A5071007038

Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations

2024 · Seoah Kim, YehRi Kim, et al. · Journal of Materials Research and Technology · 10

Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding

2024 · Seonghui Han, Sang-Eun Han, et al. · Materials · 9

Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review

2026 · Dong Bae Park, Jinho Jo, et al. · Micromachines · 5

Fabrication of Sub-10 μm Microvias Using Nanosecond UV Laser Drilling and a Sacrificial Metal Barrier Layer for Advanced Fine-Pitch Packaging

2026 · Nam-Son Park, Tae-Young Lee, et al. · Micromachines · 1

Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)

2025 · Sang-Eun Han, Dong-Gyu Choi, et al. · Materials · 1

Transient Liquid Phase Bonding Using Sputtered Cu/Sn Multilayers

2026 · Dong-Yurl Yu, Junhyuk Son, et al. · Materials

Effect of laser bonding time on the interfacial microstructure and mechanical properties of Sn-3.0Ag-0.5Cu solder joints

2026 · Dong-Yurl Yu, Junhyuk Son, et al. · Microelectronics Reliability

Works count: 7

Citation count: 26

H-index: 3

I10-index: 1