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Adlil Aizat Ismail

ORCID: 0000-0002-1528-2843
Observed ORCID: 0000-0002-1528-2843
OpenAlex ID: A5071162986
Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages
2022 · Adlil Aizat Ismail, Maria Abu Bakar, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 15
Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework
2024 · Adlil Aizat Ismail, Maria Abu Bakar, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 9
Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
2022 · Adlil Aizat Ismail, Maria Abu Bakar, et al. · Scientific Reports · 9
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Undissolved gold in fine-pitch BGA solder joint under thermal cycling test
2024 · Adlil Aizat Ismail, Maria Abu Bakar, et al. · Journal of Materials Science Materials in Electronics · 5
Thermal-induced Damage on Solder Joints of High-density Adjacent Ball Grid Array Components During the Rework Process
2022 · Adlil Aizat Ismail, Maria Abu Bakar, et al. · Jurnal Teknologi · 4
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Effects of Underfill Materials on Behavior of Intermetallic Compound Thickness of Ball Grid Array Solder Joints Using ANOVA
2022 · Adlil Aizat Ismail, Maria Abu Bakar, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 4
Board Level-Component Solder Joints Normalized Crack Severity Index of Solid-State Drive With Different Reliability Temperature Cycle Test Profiles
2025 · Erwan Basiron, Adlil Aizat Ismail, et al. · IEEE Transactions on Device and Materials Reliability · 3
Stereometric Analysis of Underfilled Micro Ball Grid Array Solder Joints Under Thermal Cycling Conditions
2025 · Maria Abu Bakar, Muhammad Firdaus Suhaimi, et al. · Jurnal Kejuruteraan · 2
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Predictive Modeling of IMC Growth in BGA Component Solder Joints Using Artificial Neural Networks Under Rework and Temperature Cycling Conditions
2025 · Adlil Aizat Ismail, Maria Abu Bakar, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Enhancing Ball Grid Array (BGA) Component on Printed Circuit Board (PCB) Solder Joint Integrity with Antimony Element
2025 · Azman Jalar, Ee May Lim, et al. · Journal of Failure Analysis and Prevention · 2
Artificial Neural Networks Analysis for Predicting Gold Diffusion in Solder Joints Under Various Rework and Thermal Cycling Conditions
2025 · Adlil Aizat Ismail, Maria Abu Bakar, et al. · Springer proceedings in physics · 2
Thermal Management on the Solder Joints of Adjacent Ball Grid Array (BGA) Rework Components Using Laser Soldering
2023 · Adlil Aizat Ismail, Maria Abu Bakar, et al. · Springer proceedings in physics · 2
Intermetallic Compound Thickness of Ball Grid Array Solder Joints Under Thermal Cycling Test Using ANOVA
2022 · Adlil Aizat Ismail, Maria Abu Bakar, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 2
Laser Rework Reliability: Impact of Heat Source on Lead-Free Solder Joints in Adjacent BGA Components
2025 · Adlil Aizat Ismail, Maria Abu Bakar, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 1
Influence of Epoxy Molding Compounds on Crack Severity in Lead-Free Solder Joints of Mirrored NAND Flash BGA Packages Under Thermal Cycling Conditions
2025 · Muhammad Nizam Ilias, Maria Abu Bakar, et al. · Springer proceedings in physics · 1
Crack Severity Analysis in Predicting Solder Joint Reliability for Mirrored Flip Chip Ball Grid Array Packages
2025 · Muhammad Nizam Ilias, Maria Abu Bakar, et al. · Journal of Failure Analysis and Prevention
Works count: 16
Citation count: 63
H-index: 4
I10-index: 1
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