Author

Arvind Krishna

Observed name: A. Krishna

Observed institutions: Aptiv (United States), The Ohio State University

ORCID: 0009-0005-2308-2111

Observed ORCID: 0009-0005-2308-2111

OpenAlex ID: A5071248780

Effect of Solder Voids on Thermal Performance of a High Power Electronic Module

2006 · L. Biswal, A. Krishna, et al. · Electronic Packaging Technology Conference · 29

Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging

1995 · Arvind Krishna, B. D. Harper, et al. · Journal of Electronic Packaging · 13

Effect of Post-Mold Curing of Epoxy Molding Compound on Wirebond Reliability in a MOSFET

2007 · Rohit T. Nayak, Toufique Ahmed, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 6

Edge delamination of residually stressed thin films: viscoelastic effects

1996 · A. Krishna · International Journal of Fracture · 5

Impact of boundary conditions, glass fiber orientation and stress-free temperature on the performance of a plastic-enclosed electronic product in a thermal cycling environment

2012 · Shrikant N. Bhadri, Arvind Krishna · International Conference on Electronic Packaging Technology (ICEPT) · 3

Stress Cracking of Polycarbonate Exposed to Sunscreen

2011 · Arvind Krishna, Eric Berg · SAE International Journal of Materials and Manufacturing · 3

Design of a Vibration-Sensitive Electronics Module with Glass-Filled Plastics

2006 · Rohit T. Nayak, Arvind Krishna, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2

Stress Analysis of Instrument Panel Knobs

2000 · Arvind Krishna · SAE technical papers on CD-ROM/SAE technical paper series · 2

Development of an Analytical Tool for Multilayer Stack Assemblies

2011 · Rammohan B, Sanjay Singh Chauhan, et al. · SAE technical papers on CD-ROM/SAE technical paper series · 1

Head Impact Analysis of a Typical Instrument Panel Mounted Radio

2007 · Kishan B. Sreenath, Arvind Krishna · SAE technical papers on CD-ROM/SAE technical paper series · 1

System Level Considerations in the Incorporation of a Component Thermal Model for an Automotive Application

2005 · Victor Chiriac, Tom Lee, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 1

Wirebond Reliability Assessments and Layout Guidelines for a TO247 Package Using FEA

2005 · Rohit T. Nayak, Judy Cheng Chean Fay, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 1

Finite Element Analysis of a Radio Mounting Clip Under Rear Crash Loading Environment

2004 · Shrikant N. Bhadri, Arvind Krishna, et al. · SAE technical papers on CD-ROM/SAE technical paper series · 1

Computational and Experimental Studies for Radio Thermal Management

1997 · Arvind Krishna · SAE technical papers on CD-ROM/SAE technical paper series · 1

A Rapid Temperature Superposition Method to Determine Creep Behaviour of Thermoplastics for Automotive Electronics Applications

2009 · Mukund Kulkarni, Arvind Krishna · SAE technical papers on CD-ROM/SAE technical paper series

Fracture Property Characterization of Glass Filled Epoxy Material for Automotive Electronics

2007 · Ajay Singh, Arvind Krishna, et al. · SAE technical papers on CD-ROM/SAE technical paper series

Effect ofPost-Mold Curing ofEpoxyMolding CompoundonWirebond Reliability inaMOSFET

2007 · Rohit T. Nayak, Toufique Ahmed, et al.

Design ofaVibration-Sensitive Electronics ModulewithGlass-Filled Plastics

2006 · Arvind Krishna

Viscoelastic stress analysis of thin polyimide films in electronic packaging applications

1995 · Arvind Krishna · OhioLink ETD Center (Ohio Library and Information Network)

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Works count: 19

Citation count: 69

H-index: 4

I10-index: 2