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Sascha Dieter
Observed names:
Dieter, Sascha,
S. Dieter
Institution:
Atotech (Germany)
Observed institutions:
Atotech (Germany),
Technische Universität Berlin,
Atotech (United States)
OpenAlex ID:
A5071650718
Observation and analysis of mixed domain states in sputtered Co50Fe50 films
2003
·
Jeffrey McCord
, Sascha Dieter
, et al.
·
Journal of Magnetism and Magnetic Materials
·
10
Correlation between magnetic properties of CoFe single and CoFe/SiO2multi-layer thin films and their microstructure, texture and internal stress state
2004
·
S. Dieter
, A. Pyzalla
, et al.
·
International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde)
·
7
Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures
2021
·
T. Bernhard
, S. Dieter
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
Facet type determination based on combined atomic force microscopy and electron backscatter diffraction
2023
·
Ralf Brüning
, Mehrad Hajati
, et al.
·
Journal of Microscopy
·
3
Crystal facets and surface morphology as a function of crystal orientation by automatic alignment of AFM and EBSD data: application to etched copper polycrystals
2025
·
Ralf Brüning
, Sawyer Stanley
, et al.
·
Journal of Materials Science
·
2
A Predictive Metallographic Means to Identify The Relative Risk of Failure for Plated Micro Vias
2023
·
Tobias Bernhard
, Roger Massey
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
2
Relation between surface morphology, facet selection, and crystal orientation in electroless copper deposits on polycrystalline copper substrates
2026
·
Ralf Brüning
, Abhijit Singh
, et al.
·
Thin Solid Films
·
1
Correction: Crystal facets and surface morphology as a function of crystal orientation by automatic alignment of AFM and EBSD data: application to etched copper polycrystals
2025
·
Ralf Brüning
, Sawyer Stanley
, et al.
·
Journal of Materials Science
·
1
PDF
Smart Electroless Copper Bath for SAP Applications
2023
·
Stefanie Manuela Bremmert
, Sascha Dieter
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
Optimization of the Copper Microstructure to Improve Copper-to-Copper Direct Bonding
2023
·
Ralf Schmidt
, Christian Schwarz
, et al.
·
IMAPSource Proceedings
·
1
PDF
Hydrogen Embrittlement Suppressors for Nickel-Free Electroless Copper Baths
2022
·
Tobias Bernhard
, Stefanie Manuela Bremmert
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
A Modular Electroless Copper Bath System for SAP Applications
2025
·
Tobias Bernhard
, André Beyer
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Copper Crystal Structures in Plated Microvias. Their Recrystallisation and a Means to Identify Joints at Risk of Premature Failure
2021
·
T. Bernhard
, R. Massey
, et al.
·
International Symposium on Microelectronics
PDF
Influence of stress and microstructure on the domain distribution in sputtered high moment Fe/sub 50/Co/sub 50/ films
2004
·
J. McCord
, S. Dieter
, et al.
·
IEEE International Magnetics Conference
Mikrostruktur und magnetische Eigenschaften von CoFe- Ein- und CoFe-/SiO2-Viellagenschichten
2002
·
Dieter, Sascha
·
DepositOnce
PDF
Dependence of Magnetic Properties, Texture and Residual Stresses on the Deposition Parameters of CoFe – Single and Multi – Layers
2002
·
S. Dieter
, Anke Pyzalla
, et al.
·
Materials science forum
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Works count:
16
Citation count:
34
H-index:
3
I10-index:
1
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