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Olivier Valorge

An active reconfigurable circuit board
2008 · Richard Norman, Olivier Valorge, et al. · IEEE Interregional NEWCAS Conference (NEWCAS) · 32
A Simple Way for Substrate Noise Modeling in Mixed-Signal ICs
2006 · O. Valorge, C. Andrei, et al. · IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications · 18
An interconnection network for a novel reconfigurable circuit board
2008 · Richard Norman, Etienne Lepercq, et al. · IEEE Interregional NEWCAS Conference (NEWCAS) · 15
An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration
2015 · Jean-Etienne Lorival, Francis Calmon, et al. · Microelectronics Journal · 10
Experimental and simulation results on Si integrated inductor efficiency for smart RF-ICs
2014 · A. S. Royet, J. C. Barbe, et al. · IEEE International Conference on Electronics, Circuits and Systems (ICECS) · 10
An interconnection network for a novel reconfigurable circuit board
2009 · Etienne Lepercq, Olivier Valorge, et al. · Microsystems and Nanoelectronics Research Conference (MNRC) · 10
Implementation of binarized neural networks immune to device variation and voltage drop employing resistive random access memory bridges and capacitive neurons
2024 · Mona Ezzadeen, Atreya Majumdar, et al. · Communications Engineering · 9
Impact of low-frequency substrate disturbances on a 4.5 GHz VCO
2006 · Francis Calmon, Cristian Andrei, et al. · Microelectronics Journal · 9
Modelling of through silicon via and devices electromagnetic coupling
2010 · Mohamed Abouelatta-Ebrahim, Rabah Dahmani, et al. · Microelectronics Journal · 8
A low-power, small-area voltage reference array for a wafer-scale prototyping platform
2010 · Nicolas Laflamme-Mayer, Olivier Valorge, et al. · IEEE Interregional NEWCAS Conference (NEWCAS) · 7
Hybrid Integration of 3D-RF Interconnects on AlGaN/GaN/Si HEMT RF Transistor featuring 2.2W/mm Psat & 41% PAE @28GHz using a Robust and Cost-Effective Chiplet Heterogeneous Bonding Technique
2024 · A. Divay, O. Valorge, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 5
Configurable Input–Output Power Pad for Wafer-Scale Microelectronic Systems
2012 · Nicolas Laflamme-Mayer, Walder Andre, et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 5
Analytical and Numerical Model Confrontation for Transfer Impedance Extraction in Three-Dimensional Radio Frequency Circuits
2012 · Olivier Valorge, Fengyuan Sun, et al. · Circuits and Systems · 5
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Mixed-signal IC design guide to enhance substrate noise immunity in bulk silicon technology
2009 · Olivier Valorge, Francis Calmon, et al. · Analog Integrated Circuits and Signal Processing · 5
Bruit d'Alimentation et Couplage par le Substrat dans les Circuits Mixtes
2006 · Olivier Valorge · OpenGrey (Institut de l'Information Scientifique et Technique) · 5
RF Performances and De-Embedding Techniques of Passive Devices in 3D Homogeneous Integration at Sub-THz
2023 · A. Oliveira, O. Valorge, et al. · European Microwave Conference (EuMC) · 4
Comparative life cycle assessment of hybrid bonding and copper pillar die-to-wafer 3D integrations for sub-THz applications
2023 · Léa Roulleau, Laura Vauche, et al. · European Microwave Integrated Circuits Conference · 4
Impact of substrate perturbation on a 5 GHz VCO spectrum
2005 · C. Andrei, O. Valorge, et al. · International Conference on Microelectronics (ICM) · 4
Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies
2024 · Mohammad Alsukour, Olivier Valorge, et al. · IEEE International D Systems Integration Conference · 3
A spatially reconfigurable fast differential interface for a wafer scale configurable platform
2010 · Olivier Valorge, Yves Blaquiere, et al. · IEEE International Conference on Electronics, Circuits and Systems (ICECS) · 3
Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking
2010 · E. Eid, T. Lacrevaz, et al. · Microelectronic Engineering · 3
Digital signal propagation on a wafer-scale smart active programmable interconnect
2008 · Olivier Valorge, Anh Tuan Nguyen, et al. · IEEE International Conference on Electronics, Circuits and Systems (ICECS) · 3
On a standard approach for substrate noise modelling in mixed signal IC's
2005 · O. Valorge, C. Andrei, et al. · International Conference on Microelectronics (ICM) · 3
Design slope constraint for reducing noise generation and coupling mechanisms in mixed signal IC's
2004 · O. Valorge, C. Andrei, et al. · IEEE International Symposium on Industrial Electronics (ISIE) · 3
Frequency and time domain characterization of substrate coupling effects in 3D integration stack
2010 · E. Eid, T. Lacrevaz, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 2
Works count: 56
Citation count: 198
H-index: 8
I10-index: 6
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