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Karine Abadie

Application of temporary adherence to improve the manufacturing of 3D thin silicon wafers
2019 · K. Abadie, P. Montméat, et al. · International Journal of Adhesion and Adhesives · 19
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3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications
2024 · Stéphane Nicolas, Jerzy-Javier Suarez-Berru, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 16
Characterization and mitigation of local wafer deformations introduced by direct wafer-to-wafer bonding
2024 · Richard J. F. van Haren, Suwen Li, et al. · SPIE Novel Patterning Technologies · 11
Study and Control of the Distortion Induced by the Bonding Process for BSPDN Approaches
2024 · Karine Abadie, Ivanie Mendes, et al. · IEEE International Interconnect Technology Conference (IITC) · 10
Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations
2023 · Richard J. F. van Haren, Suwen Li, et al. · 9
SAB-Enabled Room Temperature Hybrid Bonding
2023 · Pablo Renaud, Karine Abadie, et al. · ECS Transactions · 8
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Engineered SiC materials for power technologies
2022 · W. Schwarzenbach, S. Rouchier, et al. · International Conference on IC Design and Technology · 7
Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations
2024 · Margot Faure, Christophe Dubarry, et al. · Electronics System-Integration Technology Conference (ESTC) · 6
Fine pitch Nb-Nb Direct Bonding for quantum applications
2024 · Pablo Renaud, Christophe Dubarry, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 5
Surface activated Cu/SiO2 hybrid bonding for room temperature 3D integration
2025 · K. Abadie, P. Renaud, et al. · Japanese Journal of Applied Physics · 4
Modulation of post-fracture roughness with induced shear stress in the smart cut process
2024 · Lucas Colonel, Q. Lomonaco, et al. · Journal of Applied Physics · 4
Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion
2023 · Laurent Gaëtan Michaud, Frank Fournel, et al. · ECS Transactions · 4
Is NaOH Beneficial to Low Temperature Hybrid Bonding Integration?
2024 · Hadi Hijazi, Paul Noel, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 3
Soft Surface Activated Bonding of Hydrophobic Silicon Substrates
2023 · Quentin Lomonaco, Karine Abadie, et al. · ECS Transactions · 3
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TEOS and thermal oxide low temperature direct wafer bonding dynamics
2025 · L. G. Michaud, K. Abadie, et al. · Japanese Journal of Applied Physics · 2
Vacuum Quality Impact on Covalent Bonding
2023 · Karine Abadie, Quentin Lomonaco, et al. · ECS Transactions · 2
TEOS and Thermal Oxide Low Temperature Direct Wafer Bonding Dynamics
2024 · L.G. Michaud, K. Abadie, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 1
Surface Activated Cu/SiO2 Hybrid Bonding for Room Temperature 3D Integration
2024 · K. Abadie, P. Renaud, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 1
(First Best Paper Award) Vacuum Quality Impact on Covalent Bonding
2023 · Karine Abadie, Quentin Lomonaco, et al. · ECS Meeting Abstracts · 1
Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion
2023 · Laurent Gaëtan Michaud, Frank Fournel, et al. · ECS Meeting Abstracts · 1
Stress Engineering in Germanium-Silicon Heterostructure Using Surface Activated Hot Bonding
2022 · Quentin Lomonaco, Karine Abadie, et al. · ECS Transactions · 1
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Manufacturing of Optimized Ge Substrates Using a Covalent Bonding Process
2020 · Karine Abadie, Frank Fournel, et al. · ECS Meeting Abstracts · 1
Various GaAs to Si wafer bonding approaches for solar cells applications
2017 · V. Larrey, L. Vauche, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 1
Thin Layer Transfer Using Room Temperature Wafer-Level Bonding Process
2016 · Karine Abadie, Frank Fournel, et al. · ECS Transactions · 1
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Critical Process Parameters And Failure Analysis For Temporary Bonded Wafer Stacks
2016 · Elisabeth Brandl, Karine Abadie, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
Works count: 86
Citation count: 122
H-index: 7
I10-index: 4
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