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Soufyane Belhenini

Observed names: Belhenini Soufyane, Belhenini, S., S Belhenini, S. Belhenini
ORCID: 0000-0002-0272-3523
Observed ORCID: 0000-0002-0272-3523
OpenAlex ID: A5073935294
Modelling and analysis of the stress distribution in a multi-thin film system Pt/USG/Si
2018 · W Z Yao, F Roqueta, et al. · Materials Research Express · 18
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Full integration of a 3D demonstrator with TSV first interposer, ultra thin die stacking and wafer level packaging
2013 · G. Pares, C. Karoui, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 16
Conducted EMI Prediction in DC/DC Converter Using Frequency Domain Approach
2018 · Benhadda Nassireddine, Bendaoud Abdelber, et al. · International Conference on Electrical Sciences and Technologies in Maghreb · 15
Intrinsic stress effects on the warpage of silicon substrate during thin film deposition, photolithography and etching processes
2016 · WeiZhen Yao, Soufyane Belhenini, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 9
3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters
2014 · Soufyane Belhenini, Abdellah Tougui, et al. · Journal of Electronic Materials · 9
3D finite element modeling of 3D C2W (chip to wafer) drop test reliability: Optimization of internal architecture and materials
2013 · Soufyane Belhenini, Abdellah Tougui, et al. · Microelectronics Reliability · 9
Elastic modulus measurements of vertically aligned multi walled carbon nanotubes carpets by using the nanoindentation technique
2017 · Soufyane Belhenini, Thibault Labbaye, et al. · Mechanics Research Communications · 7
3-D finite elements simulation of drop test reliability on a Chip Scale Package: Focus on the component architecture and materials
2012 · Soufyane Belhenini, Abdelhake Bouchou, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
Implementation of the Homogenization Method in the Numerical Estimation of Wafer Warpage
2023 · Soufyane Belhenini, Imad El Fatmi, et al. · Coatings · 2
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Contribution to the Study of Solid-Solid Thermal Contact Resistances--A Comparative Study
2021 · Rahmouna Cheriet, Bourassia Bensaad, et al. · Annales de Chimie Science des Matériaux · 2
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Contribution to the Study of Plastic Mechanics Models of Solid-Solid Contacts
2020 · Fatiha Bouhadjela, Bourassia Bensaad, et al. · Annales de Chimie Science des Matériaux · 2
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Étude de structures de composants micro-électroniques innovants (3D) Caractérisation, modélisation et fiabilité des démonstrateurs 3D sous sollicitations mécaniques et thermomécaniques
2013 · Soufyane Belhenini · theses.fr (ABES) · 2
Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications
2023 · Imad El Fatmi, Soufyane Belhenini, et al. · Microelectronics International · 1
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact
2023 · Soufyane Belhenini, Imad El Fatmi, et al. · Soldering and Surface Mount Technology · 1
Energy density estimation of crack initiation in Sn-Ag-Cu(Ni) solder bump by nano-impact
2012 · Z. Ma, S. Belhenini, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
Energy density estimation of crack initiation in Sn-Ag-Cu(Ni) solder by nano-impact
2012 · Ma, Ze, Belhenini, S., et al. · HAL · 1
The Study of Cooling Systems for Superconducting Coils
2025 · Cheriet Rahmouna, Bensaad Burassia, et al. · Lecture notes in networks and systems
Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents
2024 · Amer Mecellem, Soufyane Belhenini, et al. · Microelectronics International
薄膜蒸着,フォトリソグラフィーとエッチングプロセス中のシリコン基板の反りに及ぼす固有応力の影響【Powered by NICT】
2016 · Yao WeiZhen, Soufyane Belhenini, et al. · IEEE Conference Proceedings
Design for thermo-mechanical reliability of a 3D microelectronic component using 3D FEM
2014 · Soufyane Belhenini, Abdellah Tougui, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Etude de structures de composants micro-électroniques innovants (3D) : caractérisation, modélisation et fiabilité des démonstrateurs 3D sous sollicitations mécaniques et thermomécaniques
2013 · Soufyane Belhenini · theses.fr (ABES)
Works count: 22
Citation count: 98
H-index: 7
I10-index: 3
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