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Author

Abel Misrak

ORCID: 0000-0002-8278-4982
Observed ORCID: 0000-0002-8278-4982
OpenAlex ID: A5074133039
Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages
2019 · Shrinath Ramdas, Pavan Rajmane, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 17
Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling
2017 · Unique Rahangdale, Rahul Srinivas, et al. · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 14
Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
2019 · Abel Misrak, Tushar Chauhan, et al. · Journal of Electronic Packaging · 12
Solder ball reliability assessment of WLCSP — Power cycling versus thermal cycling
2017 · Unique Rahangdale, B. Conjeevaram, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 12
Impact of Die Attach Sample Preparation on Its Measured Mechanical Properties for MEMS Sensor Applications
2021 · Abel Misrak, Tushar Chauhan, et al. · Journal of Microelectronics and Electronic Packaging · 10
Mechanical characterization of RCC and FR4 laminated PCBs and assessment of their board level reliability
2017 · Unique Rahangdale, A R Sakib, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 10
Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization
2019 · Jimil M. Shah, Abel Misrak, et al. · Journal of Electronic Packaging · 8
Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL
2017 · Unique Rahangdale, Pavan Rajmane, et al. · ASMC proceedings · 7
Damage progression study of 3D TSV package during reflow, thermal shocks and thermal cycling
2017 · Unique Rahangdale, Pavan Rajmane, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 5
Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
2022 · Abel Misrak, Rabin Bhandari, et al. · Journal of Electronic Packaging · 3
Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation
2018 · Abel Misrak, Luu Nguyen, et al. · Journal of Microelectronics and Electronic Packaging · 3
A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
2017 · Unique Rahangdale, Pavan Rajmane, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 2
Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL
2017 · Unique Rahangdale, Aniruddha Doiphode, et al. · International Convention on Information and Communication Technology, Electronics and Microelectronics · 2
Comparison of the effect of elastic and viscoelastic modeling of PCBs on the assessment of board level reliability
2017 · Abel Misrak, Avinash Anaskure, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 2
Impact of Viscoelastic Properties of Low Loss Printed Circuit Boards (PCBs) on Reliability of WCSP Packages Under Drop Test
2020 · Akshay Lakshminarayana, Abel Misrak, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
2017 · Unique Rahangdale, Pavan Rajmane, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Works count: 16
Citation count: 108
H-index: 7
I10-index: 6
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