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Derryl D. J. Allman

Observed names: Allman, Derryl, D. Allman, D. D. J. Allman, D.D.J. Allman, Derryl Allman, Derryl D.J. Allman
OpenAlex ID: A5074535029
1 000 000 °C/s thin film electrical heater: In situ resistivity measurements of Al and Ti/Si thin films during ultra rapid thermal annealing
1994 · L. H. Allen, G. Ramanath, et al. · Applied Physics Letters · 92
Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
2017 · Dustin Z. Austin, Melanie A. Jenkins, et al. · Chemistry of Materials · 88
Microstructural aspects and mechanism of the C49-to-C54 polymorphic transformation in titanium disilicide
1995 · Z. Ma, L. H. Allen, et al. · Journal of Applied Physics · 76
Effect of dimension scaling on the nucleation of C54 TiSi2
1994 · Z. Ma, L.H. Allen, et al. · Thin Solid Films · 36
Plasma Enhanced Atomic Layer Deposition of Al2O3/SiO2 MIM Capacitors
2015 · Dustin Z. Austin, Derryl Allman, et al. · IEEE Electron Device Letters · 23
Atomic layer deposition of bismuth oxide using Bi(OCMe2iPr)3 and H2O
2013 · Dustin Z. Austin, Derryl Allman, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 14
Dielectric Relaxation, Aging and Recovery in High-K MIM Capacitors
2021 · Konner E. K. Holden, Gavin D. R. Hall, et al. · IEEE International Reliability Physics Symposium proceedings · 10
Impact of via interactions and metal slotting on stress induced voiding
2008 · Gavin D. R. Hall, Derryl D. J. Allman, et al. · IEEE International Reliability Physics Symposium proceedings · 10
Laminate Al2O3/Ta2O5 Metal/Insulator/Insulator/Metal (MIIM) Devices for High-Voltage Applications
2019 · Melanie A. Jenkins, Dustin Z. Austin, et al. · IEEE Transactions on Electron Devices · 9
On the distribution of stress-induced voiding failures under vias
2014 · Gavin D. R. Hall, Derryl D. J. Allman · IEEE International Reliability Physics Symposium proceedings · 9
Correction to Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero Oxidation State Precursor
2018 · Dustin Z. Austin, Melanie A. Jenkins, et al. · Chemistry of Materials · 7
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An evaluation of accelerated failure time models of stress-migration and stress-induced voiding failures under vias
2015 · Gavin D.R. Hall, Derryl D.J. Allman · IEEE International Reliability Physics Symposium proceedings · 6
Reliability evaluations of ECP tools and chemistries
2012 · Gavin D.R. Hall, Derryl D.J. Allman, et al. · IEEE International Reliability Physics Symposium proceedings · 5
Using a design of experiments approach for characterization of undoped plasma-enhanced chemical-vapor deposited SiO2 film properties
1991 · D. D. J. Allman, K. P. Fuchs, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 5
Engineering the failure-free lifetime for Cu vias
2016 · Gavin D. R. Hall, Derryl D. J. Allman, et al. · IEEE International Reliability Physics Symposium proceedings · 3
Hydrothermal Synthesis of Zinc Oxide Nanowires on Kevlar using ALD and Sputtered ZnO Seed Layers
2009 · John Conley, Ashley Diane Mason, et al. · MRS Proceedings · 3
NBTI Characterization with in Situ Poly Heater
2022 · Yu-Hsing Cheng, Michael Cook, et al. · IEEE International Reliability Physics Symposium proceedings · 2
Reliability of an Al2O3/SiO2MIM Capacitor for 180nm (3.3V) Technology
2019 · J. Gambino, D. Allman, et al. · IEEE International Reliability Physics Symposium proceedings · 2
Stress Migration Modeling Using Probabilistic Physics of Failure
2018 · Gavin D. R. Hall, Derryl D. J. Allman · IEEE Transactions on Device and Materials Reliability · 2
Interactions and self-healing of Cu vias during stress migration tests and implications for burn-in and design rule formulations
2017 · Gavin D. R. Hall, Derryl D. J. Allman · IEEE International Reliability Physics Symposium proceedings · 2
Investigation of growth parameter influence on hydrothermally grown ZnO nanowires using a research grade microwave
2009 · A.D. Mason, T.F. Roberts, et al. · International Semiconductor Device Research Symposium · 2
Utilization of Poly Heater Test Structures in the Characterization of Bias Temperature Instability
2022 · Yu-Hsing Cheng, Michael Cook, et al. · IEEE International Conference on Microelectronic Test Structures (ICMTS) · 1
Bondpad Design Structural vs. Electrical Tradeoffs
2020 · Brett Williams, Robert Davis, et al. · ASMC proceedings · 1
The material characteristics of a new methyl-phenyl silsesquioxane spin-on glass for use in a global nonetchback interconnect planarization process
2002 · D.D.J. Allman, K.P. Fuchs, et al. · International IEEE VLSI Multilevel Interconnection Conference · 1
Polysilicon Fuse Electrical Voiding Mechanism AP/DFM: Advanced Patterning / Design for Manufacturability
2020 · Gang Liu, Rommel Relos, et al. · ASMC proceedings
Works count: 30
Citation count: 409
H-index: 9
I10-index: 8
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