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Laura Wenzel
Observed name:
L. Wenzel
Institutions:
Fraunhofer Institute for Reliability and Microintegration,
All Silicon System Integration Dresden
Observed institutions:
Fraunhofer Institute for Reliability and Microintegration,
All Silicon System Integration Dresden,
Technische Universität Dresden
ORCID:
0000-0003-2639-4573
Observed ORCID:
0000-0003-2639-4573
OpenAlex ID:
A5075123298
Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests
2022
·
Iuliana Panchenko
, Laura Wenzel
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
22
PDF
Influence of Heat Treatment on the Quality of Die-to-Wafer Hybrid Bond Interconnects
2024
·
Laura Wenzel
, Catharina Rudolph
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
17
Annealing Effects in Sub-8 μm Pitch Die-to-Wafer Hybrid Bonding
2024
·
Partha Mukhopadhyay
, Laura Wenzel
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
Fine-Pitch Die-to-Wafer Bonding Technologies for Chiplet Integration
2025
·
Juliana Panchenko
, Laura Wenzel
, et al.
·
European Microelectronics and Packaging Conference
·
1
Corrosion study on Cu/Sn-Ag solid-liquid interdiffusion microbumps by salt spray testing with 5 wt.% NaCl solution
2022
·
Laura Wenzel
, Maik Mueller
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
1
Position of the σ-shape and π resonances of C2H2, C2H2 and C2H6 on Cu(100) at 60 K: A nexafs study
1986
·
D. Arvanitis
, U. Döbler
, et al.
·
Surface Science Letters
Carbon K-edge structure of chemisorbed molecules by means of fluorescence detection
1986
·
D.A. Fischer
, U. Döbler
, et al.
·
Surface Science Letters
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Works count:
7
Citation count:
49
H-index:
3
I10-index:
2
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