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Author

Chad Brubaker

Observed name: C. Brubaker
Institution: EV Group (Austria)
Observed institution: EV Group (Austria)
OpenAlex ID: A5075358072
High-Performance Temporary Adhesives for Wafer Bonding Applications
2006 · Rama Puligadda, Sunil Pillalamarri, et al. · MRS Proceedings · 55
Uniformity study of wafer-scale InP-to-silicon hybrid integration
2010 · Di Liang, David C. Chapman, et al. · Applied Physics A · 38
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High-Temperature Spin-On Adhesives for Temporary Wafer Bonding
2007 · S. Pillalamarri, R. Puligadda, et al. · Journal of Microelectronics and Electronic Packaging · 16
Wafer level packaging and 3D interconnect for IC technology
2003 · R. Islam, C. Brubaker, et al. · ASMC proceedings · 10
Ultra-thick lithography for advanced packaging and MEMS
2002 · Chad Brubaker, Rafiqul Islam, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 8
High Temperature-Resistant Spin-On Adhesive for Temporary Wafer Mounting Using an Automated High-Throughput Tooling Solution
2007 · A. Smith, Rama Puligadda, et al. · 5
Thick resist alignment technology for MEMS and advanced packaging
2003 · Chad Brubaker, Bernhard Wieder, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
Temporary Wafer Bonding Materials with Adjustable Debonding Properties for Use in High-Temperature Processing
2026 · Dongshun Bai, Wenbin Hong, et al. · IMAPSource Proceedings
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TSV Thinned Wafer Debonding Process Optimization
2008 · Mark Privett, Franz Murauer, et al. · Wafer-Level Packaging Symposium
An Ultra-Thick Positive Photoresist for Advanced Electroplating Applications
2007 · Chad Brubaker, Garrett Oakes, et al. · Wafer-Level Packaging Symposium
Ultrathin-Wafer Processing Utilizing Temporary Bonding and Debonding Technology
2007 · Thorsten Matthias, Chad Brubaker, et al. · Wafer-Level Packaging Symposium
State of the Art Processing Schemes for BCB
2007 · C. Brubaker, T. Matthias, et al. · Wafer-Level Packaging Symposium
SU-8 Bonding for Transparent Packaging
2006 · C. Brubaker, T. Matthias, et al. · Wafer-Level Packaging Symposium
Advanced lithography for high aspect ratio MEMS technology
2002 · R. Islam, C. Brubaker · Microelectromechanical Systems Conference
Works count: 14
Citation count: 133
H-index: 5
I10-index: 4
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