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Kiichiro Yamanobe
Observed names:
K Yamanobe,
K. Yamanobe,
Kiichiro YAMANOBE
Institution:
Tohoku University
Observed institutions:
Tohoku University,
Keihin (Japan)
OpenAlex ID:
A5075446816
A comparative study of the mechanical strength of chemical vapor-deposited diamond and physical vapor-deposited hard coatings
2004
·
S. Kamiya
, H. Nagasawa
, et al.
·
Thin Solid Films
·
25
A new systematic method of characterization for the strength of thin films on substrates—evaluation of mechanical properties by means of ‘film projection’
2002
·
S Kamiya
, H Kimura
, et al.
·
Thin Solid Films
·
24
Analysis of Solderless Press-Fit Interconnections During the Assembly Process
2008
·
Hironori Tohmyoh
, Kiichiro Yamanobe
, et al.
·
Journal of Electronic Packaging
·
23
A comparative study of the mechanical properties of PVD coatings evaluated by new techniques and conventional methods
2004
·
S. Kamiya
, H. Nagasawa
, et al.
·
Thin Solid Films
·
18
Quantitative evaluation of bonding energy for the interfaces in Cu metallization systems
2006
·
Shoji Kamiya
, Shigeori Suzuki
, et al.
·
Journal of Applied Physics
·
11
Determination of Friction Coefficient of a Press-Fit Pin in Thin Plating
2006
·
Hironori TOHMYOH
, Kiichiro YAMANOBE
, et al.
·
JSME International Journal Series A
·
8
PDF
Strength of coatings—A new concept of mechanical evaluation on the basis of simulated fracture behavior
2005
·
Shoji Kamiya
, Shingo Amaki
, et al.
·
Surface and Coatings Technology
·
4
Fracture Resistance of Acrylic Fiber Reinforced Mortar in Shear and Flexure
1990
·
R. J. Ward
, K. Yamanobe
, et al.
·
4
Reliability Analysis of Solderless Press-Fit Interconnections
2007
·
Hironori Tohmyoh
, Kiichiro Yamanobe
, et al.
·
ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
P021 Creep Analysis of Solderless Press-Fit Interconnections
2007
·
Kiichiro YAMANOBE
, Hironori TOHMYOH
, et al.
·
The Proceedings of the Materials and Mechanics Conference
PDF
517 Experiments and Numerical Analysis of Assembly Process of Solderless Press-Fit Interconnections
2006
·
Hironori TOHMYOH
, Kiichiro YAMANOBE
, et al.
·
The Proceedings of Conference of Tohoku Branch
PDF
Evaluation of the Adhesive Toughness between Submicron Cu Thin Film and Barrier Metal
2004
·
Shoji KAMIYA
, Shigenori SUZUKI
, et al.
·
The proceedings of the JSME annual meeting
PDF
Evaluation of the Interface Toughness between Cu Film and Barrier Metal
2004
·
Shoji KAMIYA
, Shigenori SUZUKI
, et al.
·
Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuu
PDF
Strength and fracture behavior of wear-resistant coatings on different substrates
2003
·
Shoji KAMIYA
, Hideaki NAGASAWA
, et al.
·
Proceedings of the 1992 Annual Meeting of JSME/MMD
Computer-simulation-assisted measurement of thin film adhesion : A possibility of new evaluation for the strength of materials
2003
·
Shoji KAMIYA
, Hideaki NAGASAWA
, et al.
·
Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuu
PDF
Application of a new quantitative evaluation technique for the strength of PVD coatings
2002
·
Shoji KAMIYA
, Hideaki NAGASAWA
, et al.
·
The proceedings of the JSME annual meeting
PDF
K-0641 Measurement of Mechanical Properties of Thin Films on Substrates by means of "Film Projection" : Systematic Evaluation of Strength and Elastic Properties with a New Specimen Configuration
2001
·
Shoji KAMIYA
, Hiroki KIMURA
, et al.
·
The proceedings of the JSME annual meeting
PDF
Measurement of Toughness for the Diamond Coating on WC-Co Cutting Tool
2000
·
Shoji KAMIYA
, Hiroki KIMURA
, et al.
·
The proceedings of the JSME annual meeting
PDF
Tensile Failure Mechanisms and Mechanical Properties of Fiber Reinforced Concrete
1987
·
V. C. Li
, Stanley Backer
, et al.
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Works count:
19
Citation count:
117
H-index:
6
I10-index:
5
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