Get started
Author

Laurens Weiss

A generalization of Brayton-Moser's mixed potential function
1998 · L. Weiss, W. Mathis, et al. · IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications · 67
Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material
2020 · K.M.B. Jansen, M.F. Zhang, et al. · Microelectronics Reliability · 61
PDF
A thermodynamical approach to noise in non-linear networks
1998 · Laurens Weiss, Wolfgang Mathis · International Journal of Circuit Theory and Applications · 37
Reliability of Cu wire bonds in microelectronic packages
2017 · A. Mazloum-Nejadari, G. Khatibi, et al. · Microelectronics Reliability · 27
A Hamiltonian formulation for complete nonlinear RLC-networks
1997 · L. Weiss, W. Mathis · IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications · 21
Aging of epoxy moulding compound — Thermomechanical properties during high temperature storage
2016 · Bingbing Zhang, Michael Johlitz, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 17
Fatigue testing method for fine bond wires in an LQFP package
2016 · B. Czerny, A. Mazloum-Nejadari, et al. · Microelectronics Reliability · 11
A thermodynamic noise model for nonlinear resistors
1999 · L. Weiss, W. Mathis · IEEE Electron Device Letters · 10
Prediction of package delamination based on μMMT and BST experiments
2015 · Hasan Sadat Nabi, Dirk Schweitzer, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 7
Modelling of thermal aging of Moulding Compound by using an equivalent layer assumption
2017 · Bingbing Zhang, Alexander Lion, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 6
Noise Analysis of Nonlinear Electrical Circuits and Devices
2003 · Wolfgang Mathis, Laurens Weiss · Birkhäuser Basel eBooks · 5
Irreversible thermodynamics and thermal noise of non‐linear networks
1998 · Laurens Weiss, Wolfgang Mathis · COMPEL The International Journal for Computation and Mathematics in Electrical and Electronic Engineering · 5
Generalized Telegraphist's Equations for Deformed Waveguides
1998 · Laurens Weiss, Wolfgang Mathis · Electromagnetics · 5
Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions
2018 · Bingbing Zhang, Michael Johlitz, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Reliability analysis of Cu wire bonds in microelectronic packages
2016 · A. Mazloum-Nejadari, G. Khatibi, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Accurate prediction of SnAgCu solder joint fatigue of QFP packages for thermal cycling
2014 · M. Niessner, G. Schuetz, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Fully-Depleted SOI-MOSFET Model for Circuit Simulation and its Application to 1/f Noise Analysis
2004 · N. Sadachika, Y. Uetsuji, et al. · Springer eBooks · 4
Characterization of epoxy based highly filled die attach materials in microelectronics
2017 · I. Maus, C. Liebl, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
Virtual prototyping methodology for assessment of the interaction between wire bond pad design and bond process parameters to enhance the robustness of copper wire bond interconnect
2016 · Chai Chee Meng, Markus Fink, et al. · IEEE CPMT Symposium Japan (ICSJ) · 3
Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic Loading
2018 · Ali Mazloum-Nejadari, Martin Lederer, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
N-port reciprocity and irreversible thermodynamics
2002 · L. Weiss, W. Mathis · IEEE International Symposium on Circuits and Systems proceedings · 2
The Langevin equation and a more general approach to internal noise in nonlinear networks
2002 · L. Weiss, W. Mathis · IEEE International Symposium on Circuits and Systems proceedings · 2
A unified description of thermal noise and shot noise in nonlinear resistors
2000 · Laurens Weiss · AIP conference proceedings · 2
Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization — Difficulties and solution
2014 · I. Maus, H. Preu, et al. · Electronic System-Integration Technology Conference (ESTC) · 1
Noise equivalent circuit for nonlinear resistors
2003 · L. Weiss, W. Mathis · IEEE International Symposium on Circuits and Systems proceedings · 1
Works count: 29
Citation count: 311
H-index: 8
I10-index: 8
Year
Topic
Type