Author

Christina Modes

Observed names: C. MODES, C. Modes, Modes, Christina

Institution: Heraeus (Germany)

Observed institution: Heraeus (Germany)

OpenAlex ID: A5077437579

Liquid Crystal-Reconfigurable Antenna Concepts for Space Applications at Microwave and Millimeter Waves

2009 · A. Gaebler, A. Moessinger, et al. · International Journal of Antennas and Propagation · 86

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Zero Shrinkage of LTCC by Self‐Constrained Sintering

2005 · Torsten Rabe, Wolfgang A. Schiller, et al. · International Journal of Applied Ceramic Technology · 86

Design of LTCC with High Thermal Expansion

2008 · Markus Eberstein, Carsten Glitzky, et al. · International Journal of Applied Ceramic Technology · 33

Thick Printed Copper as Highly Reliable Substrate Technology for Power Electronics

2015 · Paul Gundel, Melanie Bawohl, et al. · PCIM Europe: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe) · 15

Factors Influencing the Green Body Properties and Shrinkage Tolerance of LTCC Green Tapes

2007 · Georg Besendörfer, Andreas Roosen, et al. · International Journal of Applied Ceramic Technology · 12

Technological advancements in Lead-free Wafer Bumping using Stencil Printing Technology

2005 · D. Manessis, R. Patzelt, et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft) · 8

Aqueous suspensions of glass silicate dielectric powders for ink-jet printing applications

2014 · M. Singlard, A. Aimable, et al. · Powder Technology · 7

High K Low Loss Dielectrics Co‐Fireable with LTCC

2002 · Christina Modes, Stefan Malkmus, et al. · Active and Passive Electronic Components · 5

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Highly reliable and cost effective thick film substrates for power LEDs

2016 · Paul Gundel, Ryan Persons, et al. · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · 3

Inkjet Printing Technology: A Novel Bottom-up Approach For Multilayer Ceramic Components and High Definition Printed Electronic Devices

2012 · C. DOSSOU-YOVO, M. MOUGENOT, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 3

Thermal Performance and Reliability of Copper Thick Film Substrates

2016 · Paul Gundel, Torsten Nowak, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2

Highly reliable thick film solutions for power LEDs and electronics

2015 · Paul Gundel, Melanie Bawohl, et al. · European Microelectronics and Packaging Conference · 1

Advanced DBC - Highly Reliable and Conductive Copper Ceramic Substrates

2016 · Paul Gundel, Anton Miric, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

Thick Film Pastes for Power Applications

2013 · Christina Modes, Melanie Bawohl, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

Automotive module design using self-constrained zero-shrink LTCC

2003 · T.R. Bloom, Annette Kipka, et al.

A Lead Free, Mixed Metals Low Temperature Cofire Ceramic Materials System

1997 · Michael P. O’Neill, Christina Modes

Works count: 17

Citation count: 261

H-index: 7

I10-index: 5