Author

WonJoon Kang

Observed names: W.J. Kang, Won-Joon Kang, Wonjoon Kang

Institution: Amkor Technology (United States)

Observed institution: Amkor Technology (United States)

OpenAlex ID: A5079102951

Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions

2008 · Ahmer Syed, Joan Scanlan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 30

Mechanical, thermal, and electrical analysis of a compliant interconnect

2005 · J. Galloway, A. Syed, et al. · IEEE Transactions on Components and Packaging Technologies · 25

Board level reliability study on three-dimensional thin stacked package

2004 · Jin-Young Kim, Won-Joon Kang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9

Issues in fatigue life prediction model for underfilled flip chip bump

2011 · Nokibul Islam, Ahmer Syed, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8

Board level reliability assessments of package on package

2007 · Tae-Kyung Hwang, Eun-Sook Sohn, et al. · International Conference on Electronic Materials and Packaging · 3

Board level reliability evaluation of RF PA module vias

2004 · R. Darveaux, Jicheng Yang, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 3

Board Design, Surface Mount Assembly and Board Level Reliability Aspects of Fusionquad™ Packages

2008 · Ahmer Syed, Sundar Sethuraman, et al. · SMTA International · 2

Mechanical, thermal and electrical analysis of a compliant interconnect

2004 · J. Galloway, A. Syed, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 2

Chip Board Interaction Analysis of 22-NM Fully Depeleted Silicon on Insulator (FD-SOI) Technology in Wafer Level Packaging (WLP)

2018 · Jae Kyu Cho, Jens Paul, et al. · International Wafer Level Packaging Conference (IWLPC) · 1

Lead Free Flip Chip Reliability for Various Package Types

2011 · Nokibul Islam, Miguel Jimarez, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 1

Chip Board Interaction Analysis of 22-nm Fully Depeleted Silicon on Insulator (FD-SOI) Technology in Wafer Level Packaging (WLP)

2018 · Jae Kyu Cho, Jens Paul, et al. · Wafer-Level Packaging Symposium

Effect of mild aging on package drop performance for lead free solders

2010 · SeokHo Na, SeWoong Cha, et al. · IEEE CPMT Symposium Japan (ICSJ)

Effect of Mild Aging on Package Drop Performance for Lead Free

2010 · Solders SeokHo Na, SeWoong Cha, et al.

Assembly and Board Level Reliability Considerations for 0.4 mm Pitch Ball Grid Array Packages

2005 · Joan Scanlan, Ahmer Syed, et al. · SMTA International

Board Level Reliability of QFP and QFN Type Packages with Matte Sn Lead Finish

2004 · Ahmer Syed, Won-Joon Kang, et al. · SMTA International

Board Level Assembly and Reliability Considerations for QFN Type Packages

2003 · Ahmer Syed, WonJoon Kang · SMTA International

Works count: 16

Citation count: 84

H-index: 4

I10-index: 2