Author

Mihai Gologanu

Observed names: Gologanu, Mihai, M. Gologanu
ORCID: 0000-0002-3387-5319
Observed ORCID: 0000-0002-3387-5319
OpenAlex ID: A5079627392
1993 · Mihai Gologanu, Jean-Baptiste Leblond, et al. · Journal of the Mechanics and Physics of Solids · 629
1997 · M. Gologanu, J.-B. Leblond, et al. · Springer eBooks · 482
1994 · Mihai Gologanu, Jean-Baptiste Leblond, et al. · Journal of Engineering Materials and Technology · 382
2001 · Mihai Gologanu, Jean-Baptiste Leblond, et al. · International Journal of Solids and Structures · 133
2015 · Jerzy Gawad, Dorel Banabic, et al. · International Journal of Plasticity · 84
2001 · Mihai Gologanu, Jean-Baptiste Leblond, et al. · International Journal of Solids and Structures · 67
2008 · Jean-Baptiste Leblond, Mihai Gologanu · Comptes Rendus Mécanique · 34
1997 · J. Devaux, M. Gologanu, et al. · Solid mechanics and its applications · 34
2012 · M. Gologanu, C. G. Bostan, et al. · CAS proceedings · 15
2016 · Dorel Banabic, Dan-Sorin Comsa, et al. · ESAFORM bookseries on material forming · 10
2013 · J. Gawad, D. Banabic, et al. · AIP conference proceedings · 8
2024 · Rodica Cristina Voicu, Mihai Gologanu, et al. · Nanomaterials · 7
2013 · Mihai Gologanu, Dan Sorin Comsa, et al. · AIP conference proceedings · 6
2025 · Cătălin Bogdan Ciobanu, Honorius Gâlmeanu, et al. · Lecture notes in computer science · 2
2017 · Viorel Avramescu, Mihai Gologanu · CAS proceedings · 2
2017 · Titus Sandu, George Boldeiu, et al. · CAS proceedings · 2
2014 · Cristian V. Diaconu, Keith Pratt, et al. · Procedia Engineering · 2
2025 · Răzvan Stancu, Mihai Gologanu, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 1
2024 · Rodica Cristina Voicu, Oana Nedelcu, et al. · IEEE International Conference Nanomaterials: Applications & Properties (NAP) · 1
2020 · Titus Sandu, Oana T. Nedelcu, et al. · CAS proceedings · 1
2020 · Viorel Avramescu, Mihai Gologanu · CAS proceedings · 1
Works count: 39
Citation count: 1,958
H-index: 10
I10-index: 11
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