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Hsin-Chih Shih
Institution:
Advanced Semiconductor Engineering (Taiwan)
Observed institution:
Advanced Semiconductor Engineering (Taiwan)
OpenAlex ID:
A5079636034
Solder joint reliability analysis for large size WLCSP
2017
·
Meng-Kai Shih
, Hsin-Chih Shih
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
12
Mechanical Reliability Analysis of Dual Side Molding SiP Module
2021
·
Tse-Wei Liao
, Wei-Hong Lai
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
7
Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (Digital Image Correlation) and Shadow Moiré Application
2022
·
Po Yu Liao
, Ian Ho
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
An Experimental Investigation Into Thin Silicon Die Strength Evaluation
2019
·
Hsin-Chih Shih
, Fila Tsai
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
4
Strength characterization of ultrathin chips by using large deflection theory of multi-layer plate for three-point bending tests
2024
·
Dao-Long Chen
, Chien-Ming Chen
, et al.
·
Extreme Mechanics Letters
·
3
Mechanical Tensile Behaviors of Sn-Bi Lead-Free Solder Alloys Under Different Strain Rates and Temperatures
2025
·
Min-Cheng Yu
, Nien-Chun Lin
, et al.
·
International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
·
2
Large size WLCSP analysis on temperature cycling reliability test
2016
·
Hsin-Chih Shih
, Ying-Chih Lee
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
2
High Acceleration Dynamic Methodology for Board-Level Shock Solder Joint Reliability Approach
2024
·
Min-Cheng Yu
, Nan-Yi Wu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
1
Nonlinear bending analysis of ultrathin bilayer chips in four-point bending tests considering friction and large deflection
2026
·
Dao-Long Chen
, Yi-Shen Li
, et al.
·
Microelectronics Reliability
Large Reticle Size Advanced Packaging Selection Strategy Based on Warpage: FOCoS and FOCoS-B
2026
·
Wu-Lung Wang
, Chung-Hang Lai
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
Thermal and Drop Reliability Performance of Low Temperature Solder in Fan-Out WLP structure
2026
·
Nien-Chun Lin
, Chun-Yu Yen
, et al.
·
International Conference on Electronics Packaging (ICEP)
Challenges and Solutions in Measuring Copperpolymer Interfacial Adhesion Strength in Advanced Packaging
2025
·
Wu-Lung Wang
, Hsin-Chih Shih
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
High-Speed Ball Shear Mechanism on Ni-Au Substrate & Thermal Aging Effect
2025
·
Nien-Chun Lin
, Hsin-Chih Shih
, et al.
·
International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Semiconductor Fan-Out Polymer Adhesion on Physical Vapor Deposited Copper Coupling Temperature & Humidity Effects
2024
·
Nien-Chun Lin
, Hsin-Chih Shih
, et al.
·
International Conference on Electronics Packaging (ICEP)
Package on System Level Solder Joint Stress Analysis Under Shock Test
2020
·
Hsin-Chih Shih
, HowardTW Liao
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
Reliability analysis of SiP module board level bending test
2018
·
Wei-Hong Lai
, Shao-Chen Yen
, et al.
·
International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
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Works count:
16
Citation count:
36
H-index:
4
I10-index:
1
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