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Author

Ashok Sridhar

Observed names: A Sridhar, A. Sridhar, Sridhar, A., Sridhar, Ashok
OpenAlex ID: A5079658938
Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material
2009 · A. Sridhar, D.J. van Dijk, et al. · Thin Solid Films · 70
Inkjet Printing as a Key Enabling Technology for Printed Electronics
2011 · Ashok Sridhar, Thomas Blaudeck, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 48
Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending
2014 · D.A. van den Ende, H.J. van de Wiel, et al. · Microelectronics Reliability · 45
Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substrates
2009 · A Sridhar, J Reiding, et al. · Journal of Micromechanics and Microengineering · 38
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Novel interconnect methodologies for ultra-thin chips on foils
2012 · A. Sridhar, M. Cauwe, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 20
Flexible and stretchable electronics for wearable healthcare
2014 · Jeroen van den Brand, Margreet de Kok, et al. · European Solid-State Device Research Conference · 16
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Investigation of the effects of LIFT printing with a KrF-excimer laser on thermally sensitive electrically conductive adhesives
2014 · S M Perinchery, E C P Smits, et al. · Laser Physics · 15
High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
2013 · van den Ende, Daan, Verhoeven, Frits, et al. · Ghent University Academic Bibliography (Ghent University) · 10
Application and modelling of hybrid stereolithography injection mould tooling
2006 · Daniel C. Attanasio, Neil Hopkinson, et al. · Virtual and Physical Prototyping · 8
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Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications
2015 · Ashok Sridhar, Sandeep M. Perinchery, et al. · Microelectronics Reliability · 7
Reliable Inkjet-Printed Interconnections on Foil-Type Li-Ion Batteries
2012 · N. B. Palacios-Aguilera, H. A. Visser, et al. · IEEE Transactions on Device and Materials Reliability · 7
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
2012 · Maarten Cauwe, Bjorn Vandecasteele, et al. · Electronic System-Integration Technology Conference (ESTC) · 7
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An inkjet printing-based process chain for conductive structures on printed circuit board materials
2010 · Ashok Sridhar · 5
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Towards reel-to-reel integration of ultra-thin chips to polymer foils
2012 · Marcel Tichem, Maarten Cauwe, et al. · Electronic System-Integration Technology Conference (ESTC) · 3
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Integration techniques and applications of thin chips on low cost foil substrates
2013 · Daan van den Ende, Ashok Sridhar, et al. · Ghent University Academic Bibliography (Ghent University) · 2
Novel methodology to integrate ultra-thin chips on flexible foils
2012 · A. Sridhar, M. Cauwe, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
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Inkjet printing of 3D metallic silver complex microstructures
2010 · Wessel W. Wits, Ashok Sridhar · University of Twente Research Information · 2
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Technology development for a flexible, low-cost backplane for lighting applications
2014 · Maarten Cauwe, Ashok Sridhar, et al. · Ghent University Academic Bibliography (Ghent University) · 1
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Performance of inkjet-printed structures on different substrate materials under high humidity and elevated temperature conditions
2012 · N. B. Palacios-Aguilera, H. A. Visser, et al. · Electronic System-Integration Technology Conference (ESTC) · 1
Trends and Expertise Exchange within Rapid Manufacturing in Europe
2010 · Ashok Sridhar, Daniel Attanasio, et al. · RTe Journal · 1
Adhesion Characterisation of Inkjet Printed Silver Tracks
2007 · Ashok Sridhar, D.J. van Dijk, et al. · University of Twente Research Information · 1
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An Intelligent Computer Vision Framework for Duplicate Part Detection in Complex CAD Assemblies
2026 · Hepshibha Gnanaprakasam, Ashok Sridhar · SAE technical papers on CD-ROM/SAE technical paper series
Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications
2014 · R. H. L. Kusters, A. Sridhar, et al. · Electronic System-Integration Technology Conference (ESTC)
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Active and passive component embedding into low-cost plastic substrates aimed at smart system applications
2013 · Maarten Cauwe, Bjorn Vandecasteele, et al. · IMAPSource Proceedings
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Fabrication and mechanical characterisation of inkjet printed strain gauges
2011 · H.A. Visser, U. Balda Irurzun, et al.
Works count: 31
Citation count: 310
H-index: 8
I10-index: 8
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