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Ronald Anthony Zeszut

Observed names: Ronald A. Zeszut, Ronald Zeszut
ORCID: 0000-0001-6095-1084
Observed ORCID: 0000-0001-6095-1084
OpenAlex ID: A5080659183
Determination of Redox Currents in Electroless Systems: Correct Application of Mixed Potential Analysis
2019 · Ronald Zeszut, Uziel Landau · Journal of The Electrochemical Society · 16
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Differences in Atmospheric Corrosion Severity Over Long and Short Distances
2024 · Ronald Zeszut, Douglas C. Hansen, et al. · CORROSION · 10
3D-Printed Biocompatible Frames for Electrospun Nanofiber Membranes: An Enabling Biofabrication Technology for Three-Dimensional Tissue Models and Engineered Cell Culture Platforms
2025 · Adam J. Jones, Lauren A. Carothers, et al. · Micromachines · 3
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Comparison of Atmospheric Corrosion of Silver across Multiple Locations
2022 · Ronald Zeszut, David Rubino, et al. · IEEE Lasers and Electro-Optics Society Annual Meeting (LEOS) · 3
Improvements for the Galvanostatic Reduction Technique for Silver Corrosion Product Characterization: Identifying and Mitigating the Issue of Solution Spreading
2025 · David Rubino, Ronald Zeszut, et al. · Journal of The Electrochemical Society · 2
Transport and Reactants Concentration Effects in Electroless Deposition of Copper
2017 · Ronald Zeszut, Uziel Landau · ECS Meeting Abstracts · 2
(Invited) Replicating the Corrosion Behavior of Steel and Aluminum Alloys at a Coastal Exposure Site: Using an Accelerated Combined-Effects Chamber Simulation (ACES) for Improved Laboratory Corrosion Testing
2024 · Douglas C Hansen, Raymond J. Santucci, et al. · ECS Meeting Abstracts
Calibration of the Scanning Kelvin Probe By Applied External Potential
2022 · Ronald Anthony Zeszut, Douglas C Hansen · ECS Meeting Abstracts
Additive Transport, Adsorption, and Inclusion in Electroless Deposition of Copper
2019 · Ronald Anthony Zeszut, Uziel Landau · ECS Meeting Abstracts
Rapid Characterization of Additives for Bottom-up Fill in Electroless Copper Plating
2017 · Ronald Zeszut, Uziel Landau · ECS Meeting Abstracts
Effects of Transport and Additives on Electroless Copper Plating
2017 · Ronald Zeszut · OhioLink ETD Center (Ohio Library and Information Network)
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Works count: 11
Citation count: 36
H-index: 3
I10-index: 2
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