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Author

Chih-Yen Lee

Observed institution: National Chi Nan University
ORCID: 0000-0002-1463-1124
Observed ORCID: 0000-0002-1463-1124
OpenAlex ID: A5082121729
Comparison of various low dielectric constant materials
2018 · Yi-Lung Cheng, Chih-Yen Lee, et al. · Thin Solid Films · 45
Copper Metal for Semiconductor Interconnects
2018 · Yi-Lung Cheng, Chih-Yen Lee, et al. · InTech eBooks · 31
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Comparison of Cu and Co Integration with Porous Low-k SiOCH Dielectrics
2020 · Yi-Lung Cheng, Hong-Chang Huang, et al. · Thin Solid Films · 22
Electrical and reliability characteristics of dielectric stack with low dielectric constant SiCOH and capping SiCNH films
2018 · Yi-Lung Cheng, Chih-Yen Lee, et al. · Surface and Coatings Technology · 22
Porous Low-Dielectric-Constant Material for Semiconductor Microelectronics
2019 · Yi-Lung Cheng, Chih-Yen Lee · IntechOpen eBooks · 13
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Plasma Damage on Low-k Dielectric Materials
2019 · Yi-Lung Cheng, Chih-Yen Lee, et al. · IntechOpen eBooks · 11
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Self-Assembled Monolayers on Highly Porous Low-k Dielectrics by 3-Aminopropyltrimethoxysilane Treatment
2019 · Yi-Lung Cheng, Chiao-Wei Haung, et al. · Coatings · 10
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Electrical Characteristics and Reliability of Nitrogen-Stuffed Porous Low-k SiOCH/Mn2O3−xN/Cu Integration
2019 · Yi-Lung Cheng, Yu-Lu Lin, et al. · Molecules · 7
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Comparison of Self-Assembled Monolayers Using 3-Aminopropyltrimethoxysilane and Decyltrimethoxysilane in Vapor Phase for Porous SiOCH Dielectrics
2023 · Yi-Lung Cheng, Joe Kao, et al. · Coatings · 5
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In-Situ Repair Plasma-Induced Damage and Cap Dielectric Barrier for Porous Low-Dielectric-Constant Materials by HMDS Plasma Treatment
2021 · Chih-Yen Lee, Chi-Yang Yan, et al. · Coatings · 5
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Electrical Characteristics and Reliability of SiCN/Porous SiOCH Stacked Dielectric: Effects of Deposition Temperature of SiCN Film
2021 · Yi-Lung Cheng, Yu-Lu Lin, et al. · ECS Journal of Solid State Science and Technology · 4
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Comparison of CoW/SiO2 and CoB/SiO2 Interconnects from the Perspective of Electrical and Reliability Characteristics
2023 · Yi-Lung Cheng, Kai-Hsieh Wang, et al. · Materials · 3
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Comparison of O2 plasma treatment on porous low dielectric constant material at sidewall and bottom of trench structure
2018 · Yi-Lung Cheng, Bing-Hong Lin, et al. · Thin Solid Films · 3
Cu-Induced Dielectric Breakdown of Porous Low-Dielectric-Constant Film
2017 · Yi-Lung Cheng, Chih-Yen Lee, et al. · Journal of Electronic Materials · 3
Comparison of Precursors for Self-Assembled Monolayers as Cu Barriers
2023 · Yi-Lung Cheng, Chih-Yen Lee, et al. · ECS Journal of Solid State Science and Technology · 2
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Electrical and Reliability Perspectives for Self-Forming Barrier CuSc Metallization
2021 · Yi-Lung Cheng, Wei-Fan Peng, et al. · ECS Journal of Solid State Science and Technology · 2
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Electrical and Reliability Characteristics of Self-Forming Barrier for CuNd/SiOCH Films in Cu Interconnects
2020 · Yi-Lung Cheng, Chih-Yen Lee, et al. · Coatings · 2
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Barrier-free process for fluorinated silicon glass film in Cu interconnects
2019 · Yi-Lung Cheng, Chih-Yen Lee, et al. · Thin Solid Films · 2
Effect of Copper Diffusion in Low Dielectric Constant Dielectrics Under Thermal Stress on Electrical and Reliability Characteristics
2018 · Chih-Yen Lee, Wei-Yuan Chang, et al. · ECS Meeting Abstracts · 2
Self-assembled monolayers on porous low-k dielectrics by decyltrimethoxysilane vapor treatment: A perspective from electrical characteristics and time-dependence-dielectric-breakdown reliability
2022 · Yi-Lung Cheng, Wei-Fan Peng, et al. · Thin Solid Films · 1
Comparison of Self-Assembled Monolayers on SiO2 and Porous SiOCH Dielectrics by Decyltrimethoxysilane Vapor Treatment
2022 · Yi-Lung Cheng, Wei-Fan Peng, et al. · Coatings · 1
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Effects of Cu Metal Barrier on Electrical Characteristics of Porous Carbon-Doped Oxide Film
2021 · Chih-Yen Lee, Giin-Shan Chen, et al. · ECS Journal of Solid State Science and Technology · 1
Effect of Post-Annealing on Reliability of Cu/Low- k Interconnects
2020 · Yi-Lung Cheng, Chih-Yen Lee, et al. · ECS Journal of Solid State Science and Technology · 1
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Reliability Characteristics of Low Dielectric Constant Materials Under Mechanical-Electrical Stress
2018 · Yi-Lung Cheng, Yao-Liang Huang, et al. · ECS Meeting Abstracts · 1
Comparison of Barrier Efficiency for Self-Assembled Monolayers on SiO2 by Using Decyltrimethoxysilane or 3-Aminopropyltrimethoxysilane Vapor Treatment
2023 · Yi-Lung Cheng, Chih-Yen Lee, et al. · ECS Journal of Solid State Science and Technology
Works count: 28
Citation count: 199
H-index: 7
I10-index: 7
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