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Author

Stefan Lutter

Institution: Rogers (Germany)
OpenAlex ID: A5082450358
The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics
2019 · Alain Phommahaxay, Gerald Beyer, et al. · International Wafer Level Packaging Conference (IWLPC) · 23
Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material
2016 · Alain Phommahaxay, Goedele Potoms, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 17
Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers
2014 · Hiroyuki Ishida, Stefan Lutter · Journal of Photopolymer Science and Technology · 17
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Development of multi-stack dielectric wafer bonding
2016 · Lan Peng, Soon-Wook Kim, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 7
Thin Wafer Handling Using Mechanical- or Laser-Debondable Temporary Adhesives
2015 · David Fleming, Jong-Uk Kim, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 4
Temporary bonding/de-bonding and permanent wafer bonding solutions for 3D integration
2012 · Hiroyuki Ishida, Sumant Sood, et al. · IEEE CPMT Symposium Japan (ICSJ) · 4
Micro channel cooled single emitter housing
2024 · Johannes Wiesend, Fabian Wagle, et al. · 1
Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits
2013 · Yann Civale, Herman Meynen, et al. · IEEE International D Systems Integration Conference · 1
Air-cooled VCSEL applications with Rogers micro-channel coolers (MCC)
2022 · Stefan Lutter, Johannes Wiesend, et al.
Room Temperature Temporary Bonding/ Debonding Processes for 2.5/ 3D Integration
2014 · Tim McCrone, Stefan Lutter, et al. · Wafer-Level Packaging Symposium
Works count: 10
Citation count: 74
H-index: 4
I10-index: 3
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