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Rohit Kumar Suthar

Observed names: R. K. Suthar, Rohit Suthar
OpenAlex ID: A5083061996
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
2024 · Pratik Bansode, Rohit Suthar, et al. · Journal of Electronic Packaging · 8
Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application
2024 · Jacob Lamotte-Dawaghreh, Joseph Herring, et al. · Journal of Electronic Packaging · 7
CHARACTERIZATION AND MODELING OF DENSITY AS A FUNCTION OF TEMPERATURE FOR PARAFFIN WAX PHASE CHANGE MATERIALS (PCMs)
2023 · Jacob Lamotte-Dawaghreh, Joseph Herring, et al. · Heat Transfer Research · 7
A Numerical Study Comparing Forced and Natural Convection in a High-Density Single-Phase Immersed Cooled Server
2023 · Gautam Gupta, Vivek Nair, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 6
Optimization of a Air-Cooled Heatsink for Immersion Cooling Application
2023 · Gautam Gupta, Vivek Nair, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 4
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
2023 · Pratik Bansode, Mohan Sai Ramalingam, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 3
Lattice Dynamic and Thermophysical Properties of AlSi (Silumine) Alloy: A DFT Study
2021 · R. K. Suthar, N. Y. Pandya, et al. · Journal of Nano- and Electronic Physics · 2
Investigation of the Thermomechanical Behavior of ASTRA M77 Substrate Core Under Single-Phase Liquid Immersion Cooling
2025 · Meysam Emami, Rohit Kumar Suthar, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 1
Thermal Fatigue Reliability of 3D Package TSVs and Solder Joints Under Oil Immersion Cooling
2025 · Unique Rahangdale, Sonkolon Barua, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 1
Thermo-Hydraulic Performance of Targeted Flow in Aluminum and Copper Heat Sinks for Immersion Cooling Applications
2025 · Prasanna Jayaramu, Emami Meysam, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 1
Thermal & Electrical Performance Characterization of Power Modules in Single-Phase Liquid Immersion Cooling Environments
2025 · Rohit Kumar Suthar, Amit Kumar, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 1
Investigating the Effect of Single-Phase Liquid Immersion Cooling on TG-400 Substrate Core’s Thermomechanical Characteristics
2024 · Rohit Suthar, Pratik Bansode, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 1
Assessment of Thermal Fatigue Reliability in 3D Integrated Through-Silicon Via and Solder Joint Structures Under Oil-Immersion Cooling
2026 · Unique Rahangdale, Sonkolon Barua, et al. · Journal of Electronic Packaging
Impact of Two-Phase Immersion Cooling on the Thermomechanical Properties of Halogen-Free Advanced Substrate
2025 · Akshay Boovanahally Lakshminarayana, Lochan Sai Reddy Chinthaparthy, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Bond optimization for Ceramic LGA image sensor solder joint under thermal & mechanical fatigue
2025 · Unique Rahangdale, Rohit Kumar Suthar, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
The reliability impact of 3D package TSV materials on interfacial cracks
2025 · Unique Rahangdale, Rohit Kumar Suthar, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
Electrochemical Additive Manufacturing Based Design of a Heat Sink for Single Phase Natural Convection Immersion Cooling Application
2023 · Jacob Lamotte-Dawaghreh, Joseph Herring, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Works count: 17
Citation count: 42
H-index: 4
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