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Kenny C. Otiaba
Observed names:
K. C. Otiaba,
K.C. Otiaba,
Kenny Otiaba,
Otiaba, K. C.,
Otiaba, K.C.
Observed institution:
University of Greenwich
OpenAlex ID:
A5083075844
Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges
2011
·
K.C. Otiaba
, N.N. Ekere
, et al.
·
Microelectronics Reliability
·
147
Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach
2012
·
Kenny C. Otiaba
, R.S. Bhatti
, et al.
·
Engineering Failure Analysis
·
69
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device
2012
·
Kenny C. Otiaba
, R.S. Bhatti
, et al.
·
Microelectronics Reliability
·
66
Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material
2013
·
Kenny C. Otiaba
, M.I. Okereke
, et al.
·
Applied Thermal Engineering
·
65
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics
2013
·
Mathias Ekpu
, Raj Bhatti
, et al.
·
Microelectronics Reliability
·
43
A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits
2011
·
E.H. Amalu
, W.K. Lau
, et al.
·
Microelectronic Engineering
·
32
Investigation of effects of heat sinks on thermal performance of microelectronic package
2011
·
Mathias Ekpu
, Raj Bhatti
, et al.
·
IEEE International Conference on Adaptive Science and Technology (ICAST)
·
26
Effects of thermal interface materials (solders) on thermal performance of a microelectronic package
2012
·
Mathias Ekpu
, Raj Bhatti
, et al.
·
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
·
12
Thermal effects of die-attach voids location and style on performance of chip level package
2011
·
K. C. Otiaba
, R. S. Bhatti
, et al.
·
IEEE International Conference on Adaptive Science and Technology (ICAST)
·
12
The effect of thermal constriction on heat management in a microelectronic application
2013
·
Mathias Ekpu
, Raj Bhatti
, et al.
·
Microelectronics Journal
·
6
Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R and D Challenges
2011
·
K.C. Otiaba
, N.N. Ekere
, et al.
·
Advanced materials research
·
6
Prediction and optimization of design parameters of microelectronic heat sinks
2013
·
Mathias Ekpu
, Raj Bhatti
, et al.
·
Journal of Emerging Trends in Engineering and Applied Sciences
·
5
Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device
2011
·
Kenny C. Otiaba
, Raj Bhatti
, et al.
·
Greenwich Academic Literature Archive (University of Greenwich)
·
5
Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications
2013
·
M. Ekpu
, R. Bhatti
, et al.
·
IMAPSource Proceedings
·
3
Influence of thermal ageing on void content and shear strength for selected lead free solder die-attach
2012
·
K. C. Otiaba
, N. Raju
, et al.
·
IMAPSource Proceedings
·
3
PDF
Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application
2011
·
Kenny C. Otiaba
, N.N. Ekere
, et al.
·
Greenwich Academic Literature Archive (University of Greenwich)
·
3
Thermal and thermo-mechanical performance of voided lead-free solder thermal interface materials for chip-scale packaged power device
2013
·
Kenny C. Otiaba
·
2
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Works count:
20
Citation count:
505
H-index:
9
I10-index:
9
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