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Dave Love
Observed names:
D. Love,
D.E. Love
Institution:
VMware (United States)
Observed institutions:
Intel (United States),
VMware (United States)
OpenAlex ID:
A5083301306
Design for lead‐free solder joint reliability of high‐density packages
2004
·
John Lau
, Walter Dauksher
, et al.
·
Soldering and Surface Mount Technology
·
58
Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests
2002
·
P. Towashiraporn
, G. Subbarayan
, et al.
·
Soldering and Surface Mount Technology
·
36
Reliability testing and data analysis of lead‐free solder joints for high‐density packages
2004
·
John Lau
, Nick Hoo
, et al.
·
Soldering and Surface Mount Technology
·
25
Failure analysis of lead‐free solder joints for high‐density packages
2004
·
John Lau
, Dongkai Shangguan
, et al.
·
Soldering and Surface Mount Technology
·
19
The effect of model building on the accuracy of fatigue life predictions in electronic packages
2003
·
P. Towashiraporn
, G. Subbarayan
, et al.
·
Microelectronics Reliability
·
19
Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints
2002
·
K. Yokomine
, N. Shimizu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
17
Design, materials and process for lead‐free assembly of high‐density packages
2004
·
Joe Smetana
, Rob Horsley
, et al.
·
Soldering and Surface Mount Technology
·
13
Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package
2007
·
John Lau
, Todd Castello
, et al.
·
Journal of Microelectronics and Electronic Packaging
·
5
Effects of Dwell Time on the Fatigue Life of Sn3.8Ag0.7Cu and Sn3.0Ag0.5Cu Solder Joints During Simulated Power Cycling
2007
·
D. Chan
, D. Bhate
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
Reliability testing and data analysis of an 1657CCGA (ceramic column grid array) package with lead-free solder paste on lead-free PCBs (printed circuit boards)
2004
·
J. Lau
, W. Dauksher
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
The effect of model building on the accuracy of fatigue life predictions in electronic packages
2003
·
P. Towashiraporn
, G. Subbarayan
, et al.
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
5
High-performance VLSI through package-level interconnects
2003
·
L. Liang
, J.D. Wilson
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
Reliability Evaluation of Lead-Free SnAgCu PBGA676 Components Using Tin-Lead and Lead-Free SnAgCu Solder Paste
2005
·
Jasbir Bath
, Sundar Sethuraman
, et al.
·
SMTA International
Managing repairable and consumable factory parts: Fab 9's materials management system
2002
·
D.E. Love
·
IEEE International Symposium on Semiconductor Manufacturing conference proceedings
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Works count:
14
Citation count:
212
H-index:
7
I10-index:
7
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