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Fuya Nagano

Origin of Voids at the SiO2/SiO2 and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance
2023 · F. Nagano, F. Inoue, et al. · ECS Journal of Solid State Science and Technology · 64
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Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
2022 · F. Nagano, S. Iacovo, et al. · ECS Journal of Solid State Science and Technology · 42
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Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
2020 · F. Nagano, S. Iacovo, et al. · ECS Journal of Solid State Science and Technology · 38
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Direct Bonding Using Low Temperature SiCN Dielectrics
2022 · Serena Iacovo, Fuya Nagano, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 34
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
2021 · Serena Iacovo, Lan Peng, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 29
The unique properties of SiCN as bonding material for hybrid bonding
2021 · Serena Iacovo, Soon-Wook Kim, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 19
Tip-clearance Effect on Mixing Performance of Twin Screw Extruders
2006 · T. Ishikawa, F. Nagano, et al. · International Polymer Processing · 18
Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding
2020 · Fuya Nagano, Serena Iacovo, et al. · ECS Transactions · 9
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Low-Temperature Chemical Vapor Deposition of SiCN for Hybrid Bonding
2022 · Koki Onishi, Tomoya Iwata, et al. · International Conference on Electronics Packaging (ICEP) · 6
Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn
2017 · Fuya Nagano, Masanori Kajihara, et al. · IEEE International Interconnect Technology Conference (IITC) · 4
Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding
2020 · Fuya Nagano, Serena Iacovo, et al. · ECS Meeting Abstracts · 1
One Japanese PhD Student in imec, Belgium
2023 · Fuya Nagano · Journal of The Japan Institute of Electronics Packaging
Defect Identification in Bonding Surface Layers by Positron Annihilation Spectroscopy
2019 · Fumihiro Inoue, Lan Peng, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Co/(Sn-Cu)系の固相反応拡散における化合物の成長挙動
2017 · 永野, 風矢, Nagano, Fuya, et al. · Institutional Repositories DataBase (IRDB)
3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
2017 · Inge De Preter, Jaber Derakhshandeh, et al. · IEEE International Interconnect Technology Conference (IITC)
Works count: 18
Citation count: 264
H-index: 8
I10-index: 7
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