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Yu-Chang Hsieh
Institution:
Advanced Semiconductor Engineering (Taiwan)
Observed institutions:
Advanced Semiconductor Engineering (Taiwan),
National Yunlin University of Science and Technology
OpenAlex ID:
A5084250805
Glass Based 3D-IPD Integrated RF ASIC in WLCSP
2017
·
Teck Chong Lee
, Yung-Shun Chang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
26
Design and Fabrication of Band-Pass Filter on Glass IPD for 5G New Radio
2020
·
Pao-Nan Lee
, Yu-Chang Hsieh
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
19
Characterization of through glass via (TGV) RF inductors
2016
·
Yu-Chang Hsieh
, Yung-Shun Chang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
17
3D-IPD with High Aspect Ratio Cu Pillar Inductor
2018
·
Cheng-Yuan Kung
, Chien-Hua Chen
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
7
PCB Integrated Inductor Design Optimized and Electrical Performance Analysis for Power Module Development
2019
·
Shu-Ting Yang
, Chi-Hao Chiang
, et al.
·
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
·
6
A Compact mmWave 1x4 Antenna Array Design with Shorted Parasitic Elements for 5G AiP Applications
2024
·
Sheng-Chi Hsieh
, Hong-Sheng Huang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
Integration of Foundry MIM Capacitor and OSAT Fan-Out RDL for High Performance RF Filters
2022
·
Pao-Nan Lee
, Yu-Chang Hsieh
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Design and Optimization of Test Socket for Millimeter-Wave Steerable Beam Measurement Technology
2023
·
Yu-Chang Hsieh
, Wen-Chun Hsiao
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
·
3
Design and Simulation of mm-Wave Diplexer on Substrate and Fan-Out Structure
2021
·
Yu-Chang Hsieh
, Pao-Nan Lee
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Ultra Low Profile Power Inductor Integrated in Wafer Level Package
2019
·
Yu-Chang Hsieh
, Shiuan-Yu Lin
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
Design of low power UWB CMOS LNA using RC feedback and body-bias technology
2013
·
Meng-Ting Hsu
, Yu-Chang Hsieh
, et al.
·
IEEE International Conference on ASIC (ASICON)
·
3
A 28-GHz 2×2 Antenna Array Integrated with a Butler-Matrix Beamformer IC Based on AiP Technology
2025
·
Wen-Chun Hsiao
, Hong-Sheng Huang
, et al.
·
International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
·
1
Performance comparison and analysis by electrical measurement for through-silicon vias (TSV) in wafer level package
2017
·
Yu-Chang Hsieh
, Chung-Hao Chen
, et al.
·
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
·
1
Analysis and Optimization of a Compact 1x4 Array Antenna for 5G Application
2025
·
Hong-Sheng Huang
, Wen-Chun Hsiao
, et al.
·
International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
RF Devices Integrated by Fan-Out and System-In-Package Technology
2022
·
Cheng-Yuan Kung
, Hung-Yi Lin
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Design of 3.1–10.6 GHz UWB CMOS LNA using RC feedback and self-body bias technology
2013
·
Yu-Chang Hsieh
, Meng-Ting Hsu
, et al.
·
CRC Press eBooks
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Works count:
16
Citation count:
98
H-index:
5
I10-index:
3
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