Author

Tongju Wang

Observed name: Wang Tongju

Institution: North China Institute of Aerospace Engineering

Observed institutions: Beijing University of Technology, North China Institute of Aerospace Engineering

ORCID: 0000-0002-3962-5134

Observed ORCID: 0000-0002-3962-5134

OpenAlex ID: A5084431911

Droplets generator: Formation and control of main and satellite droplets

2018 · Tongju Wang, Jian Lin, et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 22

Composite complex agent based on organic amine alkali for BTA removal in post CMP cleaning of copper interconnection

2022 · Liu Yang, Da Yin, et al. · Journal of Electroanalytical Chemistry · 19

A new method for producing uniform droplets by continuous-ink-jet technology

2018 · Tongju Wang, Jian Lin, et al. · Review of Scientific Instruments · 13

Effects of physical parameters of graded AlGaN buffer on DC characteristic and short-channel effects in AlInN/GaN high-electron mobility transistors

2023 · Tiecheng Han, Xiaocan Peng, et al. · Microelectronics Journal · 11

Composite surfactant based on AEO and ADS for colloidal silica particles removal in post CMP cleaning of copper interconnection

2023 · Liu Yang, Da Yin, et al. · Materials Science in Semiconductor Processing · 10

Investigation of the behavior of benzimidazole and its derivatives as corrosion inhibitors for cobalt in alkaline medium

2023 · Wenqian Zhang, Tongju Wang, et al. · International Journal of Electrochemical Science · 7

Dominant factors to produce single droplet per cycle using drop-on-demand technology driven by pulse electromagnetic force

2018 · Tongju Wang, Jian Lin, et al. · Vacuum · 7

Corrosion behavior and underlying mechanisms of Sn-58Bi solder balls surfaces induced by EDTA, HEDP, DTPMPA, and DTPA via chelation reactions

2025 · Yijie Luo, Tongju Wang, et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 5

Based on the technology of electromagnetic force driving and differential pressure control for producing solder balls

2020 · Tongju Wang, Yongping Lei, et al. · Materials Letters · 5

Study on the effect of anti-oxidation film formed by composite system on solder balls performance

2024 · Tongju Wang, Zipeng Lin, et al. · Microelectronics Reliability · 4

Study on Adsorption and Desorption Mechanism of CuO Particles on the Post-CMP Wafer Surface of Multi-Layered Copper

2024 · Liu Yang, Da Yin, et al. · ECS Journal of Solid State Science and Technology · 3

The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision Technology

2023 · Tongju Wang, Yahao Liu, et al. · Journal of Electronic Packaging · 3

Study of the Rapid Determination of Phosphorus in Electronic Packaging Material by Phosphorus-Molybdenum Yellow Spectrophotometry

2023 · Tongju Wang, Zipeng Lin, et al. · Journal of Electronic Materials · 3

Effects of Ge on Microstructure, Spreadability, and Mechanical Properties of the Sn-32Pb-18Cd Solder Alloy

2020 · Kangli Li, Jian Lin, et al. · Journal of Materials Engineering and Performance · 3

Research on the droplets formation of gallium based eutectic alloys based on the mode of pulse electromagnetic force

2019 · Tongju Wang, Jian Lin, et al. · Vacuum · 3

The experimental and simulation research of droplet formation larger than 1.0 mm by the disturbance of electromagnetic diaphragm and the driving of micro-injection pump

2025 · Qimei Zhang, Wang Tongju, et al. · Physics of Fluids · 1

The Inhibition Effect Mechanism of Pyrazole on Cobalt Corrosion in Alkaline Solution

2021 · Wenqian Zhang, Tongju Wang, et al. · International Journal of Electrochemical Science · 1

Fabrication of Solder Balls Exceeding 1.00 mm via Controlled Cutting and Remelting Technology for Electronic Packaging Materials

2025 · Linze Li, Tongju Wang, et al. · Journal of Electronic Materials

Effect of Film Formed by 2-Aminobenzimidazole and Ammonium Molybdate on Oxidation Resistance of Sn3.0ag0.5cu Solder Balls

2024 · Zipeng Lin, Tongju Wang, et al. · SSRN Electronic Journal

The Simulation Research of Uniform Droplets Transformation Process-from Drop on Demand to Continue Ink Jet Technology

2023 · Tongju Wang, Qimei Zhang, et al. · Journal of Physics Conference Series

Works count: 20

Citation count: 120

H-index: 7

I10-index: 5