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Author

Marcus Hildebrandt

Observed names: Hildebrandt, Marcus, M. Hildebrandt
OpenAlex ID: A5085660823
Solder fatigue acceleration prediction and testing results for different thermal test- and field cycling environments
2014 · Rainer Dudek, M. Hildebrandt, et al. · Electronic System-Integration Technology Conference (ESTC) · 14
Analyses of thermo-mechanical reliability issues for power modules designed in planar technology
2016 · Rainer Dudek, Ralf Doring, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 11
“3rd Level” Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use
2018 · R. Dudek, M. Hildebrandt, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6
Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads
2020 · R. Dudek, M. Hildebrandt, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Long-term thermal fatigue testing of solder joints and related fatigue life predictions
2018 · Rainer Dudek, M. Hildebrandt, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
2021 · A. Otto, E. Kaulfersch, et al. · Journal of Electronic Packaging · 1
A Combined Methodology to Include System Effects in Board-Level Stress Simulations
2019 · Rainer Dudek, Marcus Hildebrandt, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1
Electro-thermal-mechanical analyses on stress in silver sintered power modules with different copper interconnection technologies
2016 · R. Dudek, R. Doring, et al. · Electronic System-Integration Technology Conference (ESTC) · 1
Phm Features for Large Circuit Boards and Power Devices for Electric Drivetrain Applications
2021 · Alexander Otto, Eberhard Kaulfersch, et al.
PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
2020 · A. Otto, E. Kaulfersch, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
A Combined Methodology to Include System Effects in Board-Level Stress Simulations
2019 · Dudek Rainer, M. Hildebrandt, et al. · IEEE Conference Proceedings
Effiziente Hoch-Leistungsmodule mit optimierter thermo-elektromechanischer Zuverlässigkeit für das Elektroenergiesystem der Zukunft - EHLMOZ : Teilvorhaben ENAS: Thermo-mechanische Zuverlässigkeitsmodellierung und -optimierung zur Sicherung der erforderlichen technischen Robustheit : Abschlussbericht EHLMOZ - Juni 2017 : Laufzeit des Vorhabens: 01.07.2013 bis 31.12.2016 nach kostenneutraler Verlängerung, Berichtszeitraum: 01.01.2016 bis 31.12.2016
2017 · Dudek, Rainer, Döring, Ralf, et al. · TIB Hannover
Sub-micrometer warpage measurement setups for the verification of material models of soft solder die attaches by inverse modeling
2016 · M. Niessner, R. Dudek, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Works count: 14
Citation count: 41
H-index: 4
I10-index: 2
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