Author

Thomas Löher

Observed names: Löher, T., Löher, Th., Löher, Thomas, T Löher, T. Loher, T. Löher, Th. Löher, Thomas Loher
ORCID: 0000-0003-2941-3311
Observed ORCID: 0000-0003-2941-3311
OpenAlex ID: A5086700591
2010 · F. Bossuyt, J. Guenther, et al. · Microelectronics Reliability · 76
1997 · A. Klein, T. Löher, et al. · Applied Physics Letters · 51
1996 · A. Klein, T. Löher, et al. · Journal of Applied Physics · 40
2009 · Rene Vieroth, Thomas Loher, et al. · International Symposium on Wearable Computers · 39
2006 · Thomas Loher, Dion Manessis, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 34
1996 · O Henrion, T Löher, et al. · Surface Science · 27
1994 · T. Löher, Y. Tomm, et al. · Applied Physics Letters · 27
1997 · T. Löher, A. Klein, et al. · Journal of Applied Physics · 24
2009 · Thomas Loher, Manuel Seckel, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 23
2005 · T. Braun, K.-F. Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 22
1995 · O. Lang, A. Klein, et al. · Journal of Crystal Growth · 21
2016 · Thomas Loher, Stefan Karaszkiewicz, et al. · IEEE CPMT Symposium Japan (ICSJ) · 20
2008 · Thomas Loher, Rene Vieroth, et al. · IEEE VLSI Packaging Workshop of Japan (VPWJ) · 18
2018 · Christine Kallmayer, Florian Schaller, et al. · International Congress Molded Interconnect Devices (MID) · 17
2016 · F. Güth, P. Arki, et al. · Procedia Engineering · 17
2020 · Ivan Ndip, Kristoffer Andersson, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15
1998 · B. Ullrich, A. Koma, et al. · Solid State Communications · 15
2019 · Pierre Demumieux, Oriol Avino-Salvado, et al. · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · 13
2008 · Thomas Loher, Manuel Seckel, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 13
2010 · Thomas Loher, Manuel Seckel, et al. · Electronic System-Integration Technology Conference (ESTC) · 12
2008 · Andreas Ostmann, Thomas Loher, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 10
Works count: 82
Citation count: 795
H-index: 17
I10-index: 27
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