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Chen-Ning Li

OpenAlex ID: A5086720681
Enhancement of anti-oxidation and tensile strength of nanotwinned Cu foils by preferential Ni electrodeposition
2024 · Kang-Ping Lee, Dinh-Phuc Tran, et al. · Electrochimica Acta · 17
Low-Temperature Cu-Cu Bonding Using <111>-oriented and Nanocrystalline Hybrid Surface Grains
2024 · Chen-Ning Li, Jia-Juen Ong, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 17
Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains
2024 · Chen-Ning Li, Wei-Lan Chiu, et al. · International Conference on Electronics Packaging (ICEP) · 8
Fabrication and characterization of (111)-oriented nanocrystalline copper for low-temperature Cu-to-Cu bonding
2025 · Chen-Ning Li, Dinh-Phuc Tran, et al. · Materials Characterization · 4
Synergistic strength–ductility–conductivity enhancement in nanotwinned Cu foils via light Mn doping and twin boundary engineering
2026 · Po-Jui Su, Kang-Ping Lee, et al. · Materials Science and Engineering A · 3
Effect of Grain Size on Cu-Cu Bonding Quality for Fine-Pitch Hybrid Bonding Application
2025 · Chen-Ning Li, Tao-Chi Liu, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 3
Impact of Surface Treatment Queue Time on Low-Temperature Nanocrystalline Cu Bonding
2026 · Chen-Ning Li, Artur Kolics, et al.
Works count: 7
Citation count: 51
H-index: 4
I10-index: 2
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