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Ching-Chun Wang

A 256/spl times/256 CMOS differential passive pixel imager with FPN reduction techniques
2000 · I.L. Fujimori, Ching-Chun Wang, et al. · IEEE Journal of Solid-State Circuits · 37
Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly
2006 · Yi-Shao Lai, Tong Hong Wang, et al. · IEEE Transactions on Components and Packaging Technologies · 31
Examination of board-level drop reliability of package-on-package stacking assemblies of different structural configurations
2006 · Yi-Shao Lai, Chang-Lin Yeh, et al. · Microelectronic Engineering · 23
A study of CMOS technologies for image sensor applications
2001 · Ching-Chun Wang · 16
Optimization of board-level thermomechanical reliability of high performance flip-chip package assembly
2008 · Tong Hong Wang, Ching-Chun Wang, et al. · Microelectronic Engineering · 15
Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages
2006 · Yi-Shao Lai, Chang-Lin Yeh, et al. · Journal of Electronic Packaging · 12
The effect of hot carriers on the operation of CMOS active pixel sensors
2002 · Ching-Chun Wang, C.G. Sodini · Technical digest - International Electron Devices Meeting/Technical digest · 10
Optimal Design in Enhancing Board-level Thermomechanical and Drop Reliability of Package-on-Package Stacking Assembly
2006 · Yi-Shao Lai, Tong Hong Wang, et al. · Electronic Packaging Technology Conference · 7
Parametric study on board-level electronic test device subjected to JEDEC vibration loads
2008 · Chang-Lin Yeh, Yi-Shao Lai, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 5
Board-level Reliability of Package-on-Package Stacking Assemblies Subjected to Coupled Power and Thermal Cycling Tests
2007 · Tong Hong Wang, Yi-Shao Lai, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 3
A Study of Stray Minority Carrier Diffusion in CMOS Image Sensors
2008 · Dong-Long Lin, Ching-Chun Wang, et al. · IEEE Electron Device Letters · 2
Finite Element Analysis Procedure for Board-level Swept Sine Vibration Tests
2006 · Chang-lin Yeh, Yi-shao Lai, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 2
OLED-based physiologically-friendly very low-color temperature illumination for night
2012 · Jwo-Huei Jou, Shih-Ming Shen, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
Yet Another Wavelet Watermarking Scheme for Copyright Protection
2007 · Narn-Yih Lee, Ching-Chun Wang · IEEE Conference on Commerce and Enterprise Computing (CEC) · 1
A Registration Method for a Mixed Reality System and its Application to Robot Path Generation
2025 · Kai-Tai Song, Ching-Chun Wang · International Conference on Advanced Robotics and Intelligent Systems (ARIS)
Evaluation of Thermal Characteristics and Thermomechanical Reliability of Stacked-die Packages Under Coupled Power and Thermal Cycling Test Conditions
2007 · Tong Hong Wang, Chang-Chi Lee, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium
Coupled power and thermal cycling characteristics and reliability of stacked-die packages
2007 · Tong Hong Wang, Chang-Chi Lee, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Evaluation ofThermalCharacteristics andThermomechanical Reliability ofStacked-die Packages UnderCoupled PowerandThermalCycling TestConditions
2007 · Chang-Chi Lee, Yi‐Shao Lai, et al.
A Numerical Study of Board-level Stacked-die Packages Under Coupled Power and Thermal Cycling Test Conditions
2006 · Tong Wang, Chang-Chi Lee, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
MP 6.3 A 256 x 256 CMOS Differential Passive Pixel Imager with FPN Reduction Techniques
2000 · Iliana L. Fujimori, Ching-Chun Wang, et al.
Works count: 20
Citation count: 165
H-index: 7
I10-index: 7
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