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Paul L. Morganelli

Observed names: P. Morganelli, Paul Morganelli
OpenAlex ID: A5087059437
Stoichiometry effects on rheology of model polyurethanes at the gel point
1988 · H. Henning Winter, Paul Morganelli, et al. · Macromolecules · 228
Thermally degradable maleimides for reworkable adhesives
2009 · Xinnan Zhang, Gang‐Chi Chen, et al. · Journal of Polymer Science Part A Polymer Chemistry · 39
Molecular motions in model network polymers
1988 · L. Charles Dickinson, P. Morganelli, et al. · Macromolecules · 31
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Thermally Degradable Maleimides for Reworkable Adhesives
2009 · Osama M. Musa, Xinnan Zhang, et al. · NATO science for peace and security series. A, Chemistry and biology · 18
Viscosity of a no-flow underfill during reflow and its relationship to solder wetting
2002 · P. Morganelli, B. Wheelock · IEEE Electronic Components and Technology Conference (ECTC) · 14
Investigation of different options of pre-applied CSP underfill for mechanical reliability enhancements in mobile phones
2004 · N. Hannan, A. Kujala, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13
Differences in carbon‐13 rotating frame spin‐lattice relaxation in network and linear polymers
1987 · L. Charles Dickinson, Paul L. Morganelli, et al. · Die Makromolekulare Chemie Rapid Communications · 6
Partial pre-applied underfill for assembly and reliability of Pb-free CSPs
2005 · P. Morganelli, J. Shah, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Key Enabling Materials for 3DIC Fabrication and Device Performance
2019 · Michael Gallagher, Ed Anzures, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2
A novel no-flow flux underfill material for advanced flip chip packaging
2003 · A.Y. Xiao, Q.K. Tong, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Non-Conductive Film (NCF) Underfill: Materials, Performance, and Evolution to Next Generation Devices
2016 · Edgardo Anzures, Paul Morganelli, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
Dielectric studies of various olefin/SO2 copolymers
1997 · Bahatti̇n M. Baysal, Candan Erbil, et al. · TURKISH JOURNAL OF CHEMISTRY · 1
Highly Reworkable Board-Level Underfill for Large PoP Devices
2026 · Alisha Adams, Ian Cole, et al. · IMAPSource Proceedings
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Rheological Effects in Underfill Jet-Dispensing
2006 · Vinod Mohan, Paul Morganelli, et al. · SMTA International
A Comparison of Epoxy and Cyanate Ester Underfills for FCOB Assembly
2004 · Paul Morganelli · SMTA International
Materials characterization and requirements of package applied underfill
2004 · Jayesh Shah, P. Morganelli, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Bimolecular and intramolecular fluorescence quenching of an amine by a nitrile
1985 · Paul L. Morganelli
Works count: 18
Citation count: 361
H-index: 6
I10-index: 6
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