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Jae B. Kwak
Observed name:
Jae Kwak
Institution:
Chosun University
Observed institutions:
Binghamton University,
State University of New York,
Chosun University,
Samsung (South Korea),
Samsung Electronics (South Korea)
ORCID:
0000-0002-7507-6021
Observed ORCID:
0000-0002-7507-6021
OpenAlex ID:
A5087173630
Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / Impact
2007
·
Seungbae Park
, Chirag Shah
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
72
Dynamic responses of PCB under product-level free drop impact
2010
·
Da Yu
, Jae B. Kwak
, et al.
·
Microelectronics Reliability
·
47
Reliability and thermal fatigue life prediction of solder joints for advanced automotive microelectronics
2021
·
Jiachen Gao
, Jae B. Kwak
·
Journal of Mechanical Science and Technology
·
45
Effect of glue on reliability of flip chip BGA packages under thermal cycling
2010
·
Tung T. Nguyen
, Donggun Lee
, et al.
·
Microelectronics Reliability
·
43
Realistic warpage evaluation of printed board assembly during reflow process
2015
·
Soonwan Chung
, Jae B. Kwak
·
Soldering and Surface Mount Technology
·
29
Influence of fastening methods on the dynamic response and reliability assessment of PCBS in cellular phones under free drop
2008
·
Seungbae Park
, Abdullah Al-Yafawi
, et al.
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
25
Fabrication of a Conjugated Fluoropolymer Film Using One-Step iCVD Process and its Mechanical Durability
2019
·
Hyo Seong Lee
, Hayeong Kim
, et al.
·
Coatings
·
22
PDF
Integrated hygro-swelling and thermo-mechanical behavior of mold compound for MEMS package during reflow after moisture preconditioning
2015
·
Jae B. Kwak
, Seungbae Park
·
Microelectronics International
·
22
Comparative Study on Reliability and Advanced Numerical Analysis of BGA Subjected to Product-Level Drop Impact Test for Portable Electronics
2020
·
Soonwan Chung
, Jae B. Kwak
·
Electronics
·
20
PDF
Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition
2014
·
Jae Kwak
·
Journal of Mechanical Science and Technology
·
20
WiFi-Based Human Identification with Machine Learning: A Comprehensive Survey
2024
·
Manal Mosharaf
, Jae B. Kwak
, et al.
·
Sensors
·
14
PDF
Completely in situ and non-contact warpage assessment using 3D DIC with virtual patterning method
2018
·
Jae B. Kwak
·
The International Journal of Advanced Manufacturing Technology
·
14
Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects
2015
·
Jae B. Kwak
, Soonwan Chung
·
Soldering and Surface Mount Technology
·
13
Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
2008
·
S. B. Park
, Chirag Shah
, et al.
·
Journal of Electronic Packaging
·
13
Development of PCB design guide and PCB deformation simulation tool for slim PCB quality and reliability
2013
·
Soonwan Chung
, Gyun Heo
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
10
The effects of underfill on the thermal fatigue reliability of solder joints in newly developed flip chip on module
2012
·
Jae B. Kwak
, Soonwan Chung
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
10
Effect of damping and air cushion on dynamic responses of PCB under product level free drop impact
2009
·
Seungbae Park
, Da Yu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
10
Effect of Shield-Can Design on Dynamic Responses of PCB Under Board Level Drop Impact
2009
·
Da Yu
, Jae B. Kwak
, et al.
·
ASME International Mechanical Engineering Congress and Exposition (IMECE)
·
9
A Numerical Approach to Characterize the Efficiency of Cyclone Separator
2023
·
Yu Rim Kang
, Jae B. Kwak
·
Machines
·
8
PDF
Realistic Creep Characterization for Sn3.0Ag0.5Cu Solder Joints in Flip Chip BGA Package
2019
·
Ho Hyung Lee
, Jae B. Kwak
·
Journal of Electronic Materials
·
8
Enhancing cover glass fracture resistance for hand-held devices with PEALD-based Al2O3 coating
2019
·
Jiachen Gao
, Hoyeon Kim
, et al.
·
Ceramics International
·
8
Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)
2011
·
Jae B. Kwak
, Da Yu
, et al.
·
ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
·
8
Deformation and Strain Measurement of Flip-Chip Solder Bump Under In-Situ Thermal Loading
2009
·
Jae B. Kwak
, Dong Gun Lee
, et al.
·
ASME International Mechanical Engineering Congress and Exposition (IMECE)
·
7
Effect of Shield-Can on Dynamic Response of Board-Level Assembly
2012
·
Da Yu
, Jae Kwak
, et al.
·
Journal of Electronic Packaging
·
6
A novel evaluation of shock absorption and adhesive strength under shear impact loading
2020
·
Soon-Wan Chung
, Jae B. Kwak
·
The Journal of Adhesion
·
5
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Works count:
50
Citation count:
522
H-index:
13
I10-index:
17
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