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Cheryl Tulkoff
Observed name:
C. Tulkoff
Observed institutions:
IBM (United States),
DfR Solutions (United States),
National Instruments (United States)
ORCID:
0009-0006-6968-7498
Observed ORCID:
0009-0006-6968-7498
OpenAlex ID:
A5087255144
Design for Manufacturability
2021
·
Cheryl Tulkoff
, Greg Caswell
·
Wiley eBooks
·
20
Design for Excellence in Electronics Manufacturing
2021
·
Cheryl Tulkoff
, Greg Caswell
·
Wiley eBooks
·
13
Design for Sustainability
2021
·
Cheryl Tulkoff
, Greg Caswell
·
Wiley eBooks
·
9
Benchmarking and QFD: accelerating the successful implementation of no clean soldering
2002
·
S. Gutierrez
, C. Tulkoff
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
4
Challenges with manufacturability of package on package (PoP)
2013
·
Petri Savolainen
, Craig Hillman
, et al.
·
2
Obsolescence Management & the Impact on Reliability
2012
·
Cheryl Tulkoff
, Greg Caswell
·
IMAPSource Proceedings
·
2
“Green” product - how worldwide enviromental lesgislation has dramatically altered the technology landscape in the US
2006
·
Cheryl Tulkoff
, Stefanie Breyer
·
IEEE/UT Engineering Management Conference
·
2
Temperature Cycling and Fatigue in Electronics
2014
·
Gilad Sharon
, Cheryl Tulkoff
·
SMTA International
·
1
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes
2011
·
Cheryl Tulkoff
, Greg Caswell
·
IMAPSource Proceedings
·
1
Front Matter
2021
·
Cheryl Tulkoff
, Greg Caswell
·
Wiley eBooks
Index
2021
·
Cheryl Tulkoff
, Greg Caswell
·
Wiley eBooks
PDF
Root Cause Problem‐Solving, Failure Analysis, and Continual Improvement Techniques
2021
·
Cheryl Tulkoff
, Greg Caswell
·
Wiley eBooks
Design for the Use Environment: Reliability Testing and Test Plan Development
2021
·
Cheryl Tulkoff
, Greg Caswell
·
Wiley eBooks
Conclusion to Design for Excellence: Bringing It All Together
2021
·
Cheryl Tulkoff
, Greg Caswell
·
Wiley eBooks
Design for Reliability
2021
·
Cheryl Tulkoff
, Greg Caswell
·
Wiley eBooks
Establishing a Reliability Program
2021
·
Cheryl Tulkoff
, Greg Caswell
·
Wiley eBooks
Introduction to Design for Excellence
2021
·
Cheryl Tulkoff
, Greg Caswell
·
Wiley eBooks
Thermal Events: Root Cause Analysis & Prevention for Electronics
2015
·
Cheryl Tulkoff
·
On-Demand Webinars
BTC: Bottom Termination Component or Biggest Technical Challenge?
2014
·
Greg Caswell
, Cheryl Tulkoff
·
SMTA International
To Kill a Circuit Board: Perils in Manual Soldering and Cleaning Processes
2014
·
Cheryl Tulkoff
·
SMTA International
Non-Functional Pads: Should They Stay or Should They Go?
2014
·
Greg Caswell
, Cheryl Tulkoff
·
Soldering and Reliability Conferences
Higher Density Packaging: Manufacturability & Reliability
2014
·
Cheryl Tulkoff
·
On-Demand Webinars
Using Nanocoatings: Opportunities & Challenges for Medical Devices
2013
·
Cheryl Tulkoff
·
Medical Electronics Symposium
Design for Reliability with Computer Modeling
2013
·
Randy Schueller
, Cheryl Tulkoff
·
SMTA International
Best Practices for Improving the PCB Supply Chain: Performing the Process Audit
2013
·
Cheryl Tulkoff
, Greg Caswell
, et al.
·
SMTA International
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Works count:
31
Citation count:
54
H-index:
4
I10-index:
2
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