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Barbara Bonnet

Observed names: B. Bonnet, Bonnet, Barbara
Institution: Thales (France)
OpenAlex ID: A5087505473
Miniaturized C-Band SIW Filters Using High-Permittivity Ceramic Substrates
2015 · Michel Le Coq, Eric Rius, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 37
Aerosol jet printing of millimeter wave transmission lines on 3D ceramic substrates made by additive manufacturing
2018 · Anthony Delage, Nicolas Delhote, et al. · IEEE MTT-S International Microwave Symposium digest · 33
A Novel Approach Toward the Integration of Fully 3-D Printed Surface-Mounted Microwave Ceramic Filters
2023 · Andrés Fontana, Anthony Delage, et al. · IEEE Transactions on Microwave Theory and Techniques · 18
3D Packaging Technology for Integrated Antenna Front-Ends
2008 · Barbara Bonnet, Philippe Monfraix, et al. · European Microwave Conference (EuMC) · 8
Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices
2015 · K. Adokanou, K. Inal, et al. · Microelectronics Reliability · 4
Miniature UHF-Band microstrip filter based on a high-permittivity ceramic material
2009 · Yann Clavet, Alexandre Manchec, et al. · European Microwave Conference (EuMC) · 4
Design of high-permittivity ceramic UHF microstrip filter for a space application
2009 · Yann Clavet, Alexandre Manchec, et al. · Asia-Pacific Microwave Conference (APMC) · 3
3D Packaging Technology for Integrated Antenna Front-Ends
2008 · Barbara Bonnet, Philippe Monfraix, et al. · European Microwave Integrated Circuits Conference · 3
Plastic QFN Packaging for Space Applications
2018 · Ignas van Dommelen, Barbara Bonnet, et al. · IMAPS Nordic Conference on Microelectronics Packaging (NordPac) · 2
Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques
2013 · W. Ben Naceur, N. Malbert, et al. · Microelectronics Reliability · 2
Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testing
2015 · Kokou Adokanou, Karim Inal, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1
Building blocks for a Ka band switch matrix using MEMS and printed circuit board technology
2010 · D. Névo, O. Vendier, et al. · European Microwave Conference (EuMC) · 1
Caractérisation de la conductivité jusqu’à 67 GHz de lignes coplanaires imprimées par jet d’aérosol
2018 · Delage, Anthony, Delhote, Nicolas, et al. · HAL
Optimisation de l’utilisation de la technologie de fabrication additive par jet aérosol
2017 · Delage, Anthony, Bonnet, Barbara, et al. · HAL
MOESM1 of Microbial biomass in compost during colonization of Agaricus bisporus
2017 · Vos, Aurin, Heijboer, Amber, et al. · Figshare
C-band SIW Bandpass Filters on High-Permittivity Ceramic Substrates
2015 · Le Coq, Michel, Rius, Eric, et al. · HAL
Custom plastic ball grid array packages for microwave space applications up to 30 GHz
2013 · Barbara Bonnet, Nicolas Malgouyres, et al.
Conception de filtres SIW miniatures sur un substrat céramique de forte permittivité
2013 · Le Coq, Michel, Rius, Eric, et al. · HAL
Use of 3D Packaging Technology for Satellite Active Antennas Front-ends
2012 · B. Bonnet, R. Chiniard, et al. · IMAPSource Proceedings
Miniature UHF-Band microstrip filter based on a high-permittivity ceramic material
2009 · Clavet, Yann, Manchec, Alexandre, et al. · HAL
Filtres miniatures microrubans en bande UHF sur matériaux céramiques à très forte permittivité
2009 · Clavet, Yann, Manchec, Alexandre, et al. · HAL
Works count: 21
Citation count: 116
H-index: 4
I10-index: 3
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