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Philippe Monnoyer
Observed names:
P Monnoyer,
P. Monnoyer
Institution:
VTT Technical Research Centre of Finland
Observed institutions:
IMEC,
VTT Technical Research Centre of Finland
OpenAlex ID:
A5087831649
Wafer-level SLID bonding for MEMS encapsulation
2013
·
H. Xu
, T. Suni
, et al.
·
Advances in Manufacturing
·
43
PDF
Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias
2012
·
Pradeep Dixit
, Tapani Vehmas
, et al.
·
Journal of Micromechanics and Microengineering
·
30
PDF
Effect of Process Gases on Fabricating Tapered Through-Silicon vias by Continuous SF6/O2/Ar Plasma Etching
2012
·
Pradeep Dixit
, Sami Vähänen
, et al.
·
ECS Journal of Solid State Science and Technology
·
27
Reliability performance of Au-Sn and Cu-Sn wafer level SLID bonds for MEMS
2014
·
H. Xu
, A. Rautiainen
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
10
The application of dry photoresists in fabricating cost-effective tapered through-silicon vias and redistribution lines in a single step
2011
·
Pradeep Dixit
, Jaakko Salonen
, et al.
·
Journal of Micromechanics and Microengineering
·
10
Wafer-level AuSn and CuSn bonding for MEMS encapsulation
2013
·
Tommi Suni
, Hongbo Xü
, et al.
·
9
ArF solutions for low-k 1 back-end imaging
2003
·
Vincent Wiaux
, Patrick K. Montgomery
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
9
Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias
2013
·
Pradeep Dixit
, Heikki Viljanen
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
5
Reliability of wafer-level SLID bonds for MEMS encapsulation
2013
·
Hongbo Xü
, Mikael Broas
, et al.
·
European Microelectronics and Packaging Conference
·
4
Low-temperature bump bonding of Timepix readout chips and CdTe sensors at Different Sensor pitches
2011
·
Hannele Heikkinen
, Akiko Gadda
, et al.
·
IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)
·
4
Indium-tin bump deposition for the hybridization of CdTe sensors and readout chips
2010
·
H Heikkinen
, A Gadda
, et al.
·
IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)
·
4
Optical extensions towards the 45-nm node
2004
·
Eric Hendrickx
, Philippe Monnoyer
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
1
5th Electronics System-Integration Technology Conference (ESTC), Helsinki, Finland, 16 18, 2014
2014
·
Hongbo Xü
, Antti Rautiainen
, et al.
·
The Institute of Electrical and Electronics Engineers
Europe Microelectronics Packaging Conference (EMPC2013)
2013
·
Hongbo Xü
, Mikael Broas
, et al.
Role of process gases in making tapered through-silicon vias for 3D MEMS packaging
2012
·
Pradeep Dixit
, Sami Vahanen
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
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Works count:
15
Citation count:
156
H-index:
7
I10-index:
5
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