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De‐Shin Liu

Observed names: De-Shin LIU, De-Shin Liu
ORCID: 0000-0002-3613-3206
Observed ORCID: 0000-0002-3613-3206
OpenAlex ID: A5088075975
Forged HITEMAL: Al-based MMCs strengthened with nanometric thick Al 2 O 3 skeleton
2014 · Martin Balog, Peter Krizik, et al. · Materials Science and Engineering A · 63
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Adiabatic Shear Banding in Plane Strain Problems
1989 · R. C. Batra, De-Shin Liu · Journal of Applied Mechanics · 58
Influence of environmental factors on energy absorption degradation of polystyrene foam in protective helmets
2003 · De-Shin Liu, Chia-Yuan Chang, et al. · Engineering Failure Analysis · 42
Synthesis, Characterization and the Solvent Effects on Interfacial Phenomena of Jatropha Curcas Oil Based Non-Isocyanate Polyurethane
2017 · Mhd. Abd. Cader M. Haniffa, Yern Chee Ching, et al. · Polymers · 31
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Failure mode analysis of lead-free solder joints under high speed impact testing
2008 · De-Shin Liu, Chia-Yuan Kuo, et al. · Materials Science and Engineering A · 31
Effect of thermoplastic appliance thickness on initial stress distribution in periodontal ligament
2015 · De-Shin Liu, Yao-Te Chen · Advances in Mechanical Engineering · 30
Adiabatic shear banding in dynamic plane strain compression of a viscoplastic material
1990 · R.C. Batra, De-Shin Liu · International Journal of Plasticity · 30
Finite element analysis of the effect of motorcycle helmet materials against impact velocity
2003 · Li‐Tung Chang, Guan‐Liang Chang, et al. · Journal of the Chinese Institute of Engineers · 25
Mechanical strength of mediopatellar plica – The influence of its fiber content
2006 · Shaw-Ruey Lyu, Jeh-En Tzeng, et al. · Clinical Biomechanics · 23
A study on the electrical resistance of solder joint interconnections
2002 · De-Shin Liu, Chin-Yu Ni · Microelectronic Engineering · 18
Effect of environmental temperature on dynamic behavior of an adjustable preload double-nut ball screw
2018 · De-Shin Liu, Pen-Chen Lin, et al. · The International Journal of Advanced Manufacturing Technology · 15
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Interval optimization of rotor-bearing systems with dynamic behavior constraints using an interval genetic algorithm
2007 · Ting-Nung Shiau, Chung-Hao Kang, et al. · Structural and Multidisciplinary Optimization · 15
Procedure for design optimization of a T-cap flip chip package
2002 · Chin-Yu Ni, De-Shin Liu, et al. · Microelectronics Reliability · 12
A thermo-mechanical study on the electrical resistance of aluminum wire conductors
2002 · De-Shin Liu, Chin-Yu Ni · Microelectronics Reliability · 12
A Finite Element Investigation into the Impact Performance of an Open-Face Motorcycle Helmet with Ventilation Slots
2017 · De-Shin Liu, Yao-Te Chen · Applied Sciences · 11
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Integrated design method for flip chip CSP with electrical, thermal and thermo-mechanical qualifications
2003 · De-Shin Liu, Chin-Yu Ni, et al. · Finite Elements in Analysis and Design · 11
Designing Experimental Methods to Predict the Expansion Ratio of EVA Foam Material and Using Finite Element Simulation to Estimate the Shoe Expansion Shape
2012 · Yi-Ren Jeng, De-Shin Liu, et al. · MATERIALS TRANSACTIONS · 10
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Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding Process
2009 · De-Shin Liu, Shu-Shen Yeh, et al. · IEEE Transactions on Advanced Packaging · 10
Application of a Genetic Algorithm to the Design Optimization of a Multilayer Probe Card for Wafer-Level Testing
2009 · De-Shin Liu, Meng-Kae Shih, et al. · IEEE Transactions on Electronics Packaging Manufacturing · 10
Carbon nanotubes used to enhance the wear properties of AlSi10Mg/CNTs nanocomposites prepared through additive manufacturing
2024 · Jia-Ming Chang, B.N. Yadav, et al. · Diamond and Related Materials · 9
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Fast Numerical Algorithm for Optimization Mold Shape of Direct Injection Molding Process
2012 · Yi-Ren Jeng, De-Shin Liu, et al. · Materials and Manufacturing Processes · 9
Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder
2008 · Ching-I. Chen, Ching-Yu Ni, et al. · IEEE Transactions on Electronics Packaging Manufacturing · 8
An Investigation of Wafer Probe Needles Mechanical Properties and Contact Resistance Changing Under Multiprobing Process
2008 · De-Shin Liu, Meng-Kae Shih, et al. · IEEE Transactions on Components and Packaging Technologies · 8
Design of a novel chip on glass package solution for CMOS image sensor device
2006 · Ching-Yang Chen, Yung-Ching Chao, et al. · Microelectronics Reliability · 8
A novel identification technique of machine tool support stiffness under the variance of structural weight
2021 · Zhen-Wei Zhuang, Jen-Chang Lu, et al. · The International Journal of Advanced Manufacturing Technology · 7
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Works count: 80
Citation count: 603
H-index: 12
I10-index: 19
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