Author

Randy Schueller

Observed names: R. D. Schueller, R. Schueller, R.D Schueller, R.D. Schueller

Observed institutions: DfR Solutions (United States), DELL (United States), University of Virginia

OpenAlex ID: A5089923352

Nucleation mechanism of the cubic ? phase in squeeze-cast aluminium matrix composites

1994 · R. D. Schueller, F. E. Wawner, et al. · Journal of Materials Science · 52

Creep Corrosion on Lead-Free Printed Circuit Boards in High Sulfur Environments

2008 · Randy Schueller · Journal of Surface Mount Technology · 47

Strengthening potential of the cubic ? precipitate in Al-Cu-Mg-Si alloys

1994 · R. D. Schueller, F. E. Wawner, et al. · Journal of Materials Science · 46

An analysis of high-temperature behavior of AA2124/SiC whisker composites

1991 · R.D. Schueller, F.E. Wawner · Composites Science and Technology · 37

Identification of a cubic precipitate observed in an cast composite

1992 · R.D Schueller, A.K Sachdev, et al. · Scripta Metallurgica et Materialia · 36

Interfacial structure of the cubic σ phase

1992 · R.D. Schueller, A.K. Sachdev, et al. · Scripta Metallurgica et Materialia · 28

Second Generation Pb-Free Alloys

2010 · Randy Schueller, Nathan Blattau, et al. · Journal of Surface Mount Technology · 16

Effects of microstructure on optimum heat treatment conditions in metal-matrix composites

1991 · R. D. Schueller, F. E. Wawner · Journal of Materials Science · 16

Evaluating shine on hair

2001 · Randy Schueller, Perry Romanowski · Cosmetics and toiletries · 7

Design of a Low‐cost Wire Bond Tape Ball Grid Array Package

1996 · R.D. Schueller, A.P. Plepys · Circuit World · 7

The Effects of Hot Rolling on AA2124 15 v/o SiC Whisker Composites

1990 · R.D. Schueller, F.E. Wawner · Journal of Composite Materials · 7

New chip scale package with CTE matching to the board

2002 · R.D. Schueller, J. Geissinger · Electronic Packaging Technology Conference · 4

Thermal and electrical performance and reliability results for cavity-up enhanced BGAs

2003 · T.F. Hayden, P.M. Harvey, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3

Performance and reliability of a cavity down tape BGA package

2002 · R.D. Schueller, D. Aeschliman, et al. · Electronic Packaging Technology Conference · 3

Stability Testing of Cosmetic Products

2023 · Perry Romanowski, Randy Schueller · CRC Press eBooks · 2

Gated carbon-based cold cathode for high current applications

2003 · Keith D. Jamison, Byron G. Zollars, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2

Stability Testing of Cosmetic Products

2001 · Perry Romanowski, Randy Schueller · CRC Press eBooks · 2

Reliability Results for a Wire Bondable Tape Ball Grid Array Package

1996 · Randy Schueller · 2

Ensuring Suitability of Cu Wire Bonded ICs for Automotive Applications

2015 · James McLeish, Randy Schueller · IMAPSource Proceedings · 1

Underfill Induced Tensile Strain Ratcheting and its Effect on Flip Chip Solder Bump Fatigue

2010 · Craig D. Hillman, Randy Schueller, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1

Connector Design for Wearables

2015 · Randy Schueller · SMTA International

Reliability of Cu Wirebonded ICs for Automotive Applications

2015 · Jim McLeish, Greg Caswell, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

Design for Reliability with Computer Modeling

2013 · Randy Schueller, Cheryl Tulkoff · SMTA International

Copper Wire Bond Failure Mechanisms

2012 · Randy Schueller · SMTA International

Leveraging Existing Market Knowledge to Ensure a Successful Transition to Pb-Free Medical Products

2012 · Randy Schueller, Cheryl Tulkoff · Medical Electronics Symposium

Works count: 31

Citation count: 319

H-index: 8

I10-index: 8