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Guangzhu Bai

Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer
2018 · Luhua Wang, Jianwei Li, et al. · Composites Part A Applied Science and Manufacturing · 122
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Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix
2019 · Guangzhu Bai, Luhua Wang, et al. · Materials Characterization · 118
High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration
2017 · Guangzhu Bai, Ning Li, et al. · Journal of Alloys and Compounds · 109
Interfacial structure evolution and thermal conductivity of Cu-Zr/diamond composites prepared by gas pressure infiltration
2018 · Luhua Wang, Jianwei Li, et al. · Journal of Alloys and Compounds · 96
Reinforcement size effect on thermal conductivity in Cu-B/diamond composite
2021 · Yongjian Zhang, Guangzhu Bai, et al. · Journal of Material Science and Technology · 68
Precise control of versatile microstructure and properties of graphene aerogel via freezing manipulation
2020 · Xiangyu Zhu, Chao Yang, et al. · Nanoscale · 66
Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles
2022 · Luhua Wang, Guangzhu Bai, et al. · Vacuum · 59
Effects of the addition of lanthanum and ultrasonic stirring on the microstructure and mechanical properties of the in situ Mg 2 Si/Al composites
2015 · Guangzhu Bai, Zheng Liu, et al. · Materials & Design · 46
Tunable coefficient of thermal expansion of Cu-B/diamond composites prepared by gas pressure infiltration
2019 · Guangzhu Bai, Yongjian Zhang, et al. · Journal of Alloys and Compounds · 44
Minimal Dy/Tb competitive lattice diffusion engineering for ultrahigh-coercivity sintered NdFeB magnets
2026 · Rui Chang, Fang Wang, et al. · Journal of Material Science and Technology · 33
Manipulating in-situ discrete carbide interlayer to achieve high thermal conductivity in Cu-B/diamond composite
2023 · Yongjian Zhang, Guangzhu Bai, et al. · Materials Today Communications · 32
High-Temperature Thermal Conductivity and Thermal Cycling Behavior of Cu–B/Diamond Composites
2020 · Guang-Zhu Bai, Yong-Jian Zhang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 32
Synergistic regulation and optimization of microstructure, coercivity, and thermal stability in sintered NdFeB magnets through grain boundary diffusion of Dy and Al elements
2024 · Rui Chang, Guangzhu Bai, et al. · Journal of Materials Research and Technology · 26
Microstructure and thermal conductivity of AlN coating on Cu substrate deposited by arc ion plating
2019 · Yongjian Zhang, Jingjie Dai, et al. · Materials Chemistry and Physics · 21
Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface
2022 · Xiaoyan Liu, Fangyuan Sun, et al. · International Journal of Minerals Metallurgy and Materials · 18
Mechanical Properties of Cu-B/Diamond Composites Prepared by Gas Pressure Infiltration
2020 · Guangzhu Bai, Yongjian Zhang, et al. · Journal of Materials Engineering and Performance · 17
Effect of ultrasonic stirring on the microstructure and mechanical properties of in situ Mg2Si/Al composite
2016 · Jixing Lin, Guangzhu Bai, et al. · Materials Chemistry and Physics · 16
Microstructure Evolution and Performance Enhancement of Sintered Aluminum Foils for Aluminum Electrolytic Capacitors
2024 · Guangzhu Bai, Zhibin Chen, et al. · Journal of Electronic Materials · 11
Super‐High Coercivity Sintered NdFeB Magnets Enabled by High‐Rate Dy/Tb Grain Boundary Synergistic Diffusion
2026 · Rui Chang, Guangzhu Bai, et al. · Rare Metals · 10
Regulating and optimizing microstructure and coercivity of semi-dense NdFeB magnets through grain boundary diffusion of TbF3
2025 · Peiyuan Ping, Fang Wang, et al. · Journal of Rare Earths · 10
Investigation of the matrix and interface of Cu–B/diamond composite by atom probe tomography
2024 · Guangzhu Bai, Yongjian Zhang, et al. · Ceramics International · 9
A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites
2024 · Guangzhu Bai, Jianwei Li, et al. · Vacuum · 7
Enhancing the thermal conductivity of Mg/diamond composites prepared by gas pressure infiltration through Zr coating and heat treatment
2025 · Guangzhu Bai, Jianwei Li, et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 6
Tunable electrical and mechanical properties of anode foils for aluminum electrolytic capacitors prepared by additive manufacturing technology
2024 · Guangzhu Bai, Changrui Wang, et al. · Journal of Materials Research and Technology · 4
Modulation of Aluminum Powder Particle Size for Synergistic Optimization of Additively Manufactured Anode Foils in Aluminum Electrolytic Capacitors
2026 · Guangzhu Bai, Sujia Guo, et al. · Journal of Electronic Materials
Works count: 28
Citation count: 980
H-index: 16
I10-index: 20
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